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參數(shù)資料
| 型號(hào)： | GS816118D-133I |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| 中文描述： | 165焊球BGA封裝？x18 Commom的I / O？頂視圖（D組） |
| 文件頁數(shù)： | 40/40頁 |
| 文件大?。?/td> | 1391K |
| 代理商： | GS816118D-133I |
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Rev: 2.12 9/2002
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
32/32
1999, Giga Semiconductor, Inc.
GS816118/36T-250/225/200/166/150/133
816118_r2_08;
811618_r2_09
Content
Updated Synchronous Truth Table
Updated Operating Currents table
Updated table on page 1; updated power numbers
Updated Recommended Operating Conditions table (added
V
DDQ
references)
Updated table on page 1
Created recommended operating conditions tables on pages
11 and 12
Updated AC Electrical Characteristics table
Added Sleep mode description on page 22
Updated Ordering Information for 225 MHz part (changed
from 7ns to 6.5 ns)
Updated BSR table (2 and 3 changed to X (value undefined))
Added 250 MHz speed bin
Deleted 180 MHz speed bin
Updated AC Characteristics table
Updated FT power numbers
Updated Mb references from 16Mb to 18Mb
Removed ByteSafe references
Changed DP and QE pins to NC
Updated ZZ recovery time diagram
Updated AC Test Conditions table and removed Output Load
2 diagram
Removed Preliminary banner
Removed pin locations from pin description table
Removed BSR table
816118_r2_09;
816118_r2_10
Content
816118_r2_10;
816118_r2_11
Content
816118_r2_11;
816118_r2_12
Content
18Mb Sync SRAM Datasheet Revision History
DS/DateRev. Code: Old;
New
Types of Changes
Format or Content
Page;Revisions;Reason
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| GS816118D-150 | Pin Strip Header; No. of Contacts:36; Pitch Spacing:0.1"; No. of Rows:2; Contact Material:Copper Alloy; Contact Plating:Gold; Leaded Process Compatible:Yes; Mounting Type:PCB Straight Thru Hole; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
| GS816118D-150I | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816118D-166 | Pin Strip Header; No. of Contacts:36; Pitch Spacing:0.1"; No. of Rows:2; Contact Material:Copper Alloy; Contact Plating:Gold; Leaded Process Compatible:Yes; Mounting Type:PCB Straight Thru Hole; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
| GS816118D-166I | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816118D-200 | Pin Strip Header; No. of Contacts:36; Pitch Spacing:0.1"; No. of Rows:2; Contact Material:Copper Alloy; Contact Plating:Gold; Leaded Process Compatible:Yes; Mounting Type:PCB Straight Thru Hole; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| GS816118D-150 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816118D-150I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816118D-166 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816118D-166I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816118D-200 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
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