
Ver: 1.2
Feb 13, 2003
TEL: 886-3-5788833
http://www.gmt.com.tw
6
G9611
Global Mixed-mode Technology Inc.
Shutdown
A low input on the SHDN pin shuts down the G9611.
In the off mode, the pass transistor, regulator control
circuit are turned off, Only reset function is turned on,
reducing the supply current below 140μA. SHDN
should be connected to V
IN
for normal operation.
Use a fast comparator, Schmitt trigger, or CMOS or
TTL Logic to drive the SHDN pin in and out of shut-
down. Rise times should be shorter than 1μs. Do not
use slow RC circuits, leave SHDN open, or allow the
input to linger between thresholds.
Foldback Current Limiting
The G9611 also include a foldback current limiter. It
monitors and controls the pass transistor’s gate volt-
age, estimating the output current and limiting it to
900mA for output voltages above 0.78V. If the output
voltage drops below 0.78V, implying a short-circuit
condition, the output current is limited to 400mA.
Thermal Overload Protection
Thermal overload protection limits total power dissipa-
tion in the G9611. When the junction temperature ex-
ceeds T
J
= +160°C, the thermal sensor sends a signal
to the shutdown logic, turning off the pass transistor
and allowing the IC to cool. The thermal sensor will
turn the pass transistor on again after the IC’s junction
temperature cools by 30°C, resulting in a pulsed out-
put during thermal overload conditions.
Thermal overload protection is designed to protect the
G9611 in the event of fault conditions. For continual
operation, the absolute maximum junction temperature
rating of T
J
= +160°C should not be exceeded.
Operating Region and Power Dissipation
Maximum power dissipation of the G9611 depends on
the thermal resistance of the case and circuit board,
the temperature difference between the die junction
and ambient air, and the rate of air flow. The power
dissipation across the device is P = I
OUT
(V
IN
-V
OUT
).
The resulting maximum power dissipation is:
(T
J
-T
A
)
P
MAX
=
(
θ
JC
+
θ
CA
)
where (T
J
-T
A
) is the temperature difference between
the G9611 die junction and the surrounding air,
θ
JC
is
the thermal resistance of the package chosen, and
θ
CA
is the thermal resistance through the printed circuit
board, copper traces and other materials to the sur-
rounding air. The thermal resistance of SOP-8 is
θ
JC
= 192°C/W .
The power dissipation of G9611 is:
P
D
= (V
IN
- V
OUT
) x I
OUT
The worst-case thermal resistance from case to air
(
θ
CA
) requirements are:
(125°C -T
A
)
θ
CA
=
P
D
Use larger copper pad area to obtain specific heat sink
thermal resistance values for larger output current,
higher input-output difference, and higher ambient
temperature.
C
D
Capacitor Selection
The reset timeout delay is set by internally pull-up R
D
(typical value 200k
) and external C
D
.
When the voltage at C
D
pin exceeds the buffer thresh-
old, typically 0.85 V
CC
, the
RESET
output high. The
voltage detector and buffer have built-in hysterisis to
prevent erratic reset operation. For C
D
= 0.1μF, typical
reset time delay is 10ms.
Regulator Output Capacitor Selection and Regula-
tor Stability
Normally, use capacitors 0.1μF minimum on the input
and 10μF minimum on the output of the G9611. The
larger input capacitor values provide better supply noise
rejection and line-transient response. Improve load tran-
sient response, stability, and power-supply rejection by
using large output capacitors. For stable operation over
the full temperature range and with load current up to
300mA, 10μF tantalum or 47μF aluminum minimum is
recommended. Too small capacitors with small ESR
can result in oscillation.
Transient Considerations
The
Typical Operating Characteristics
show the
G9611 load-transient response. Two components of
the output response can be observed on the
load-transient graphs—a DC shift from the output im-
pedance due to the different load currents, and the
transient response. Typical transients for step
changes in the load current from 5mA to 500mA are
0.1V. Increasing the output capacitor’s value attenu-
ates transient spikes.