參數(shù)資料
型號(hào): FPT-8P-M01
廠(chǎng)商: Fujitsu Limited
英文描述: SMALL OUTLINE L-LEADED PACKAGE
中文描述: 小外形L -引線(xiàn)封裝
文件頁(yè)數(shù): 1/1頁(yè)
文件大小: 32K
代理商: FPT-8P-M01
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales representatives before ordering.
FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document.
FUJITSU SEMICONDUCTOR
DATA SHEET
SMALL OUTLINE L-LEADED PACKAGE
8 PIN PLASTIC
8-pin plastic SOP
Lead pitch
1.27 mm
Package width
×
package length
5.3
×
6.35 mm
Lead shape
Gullwing
Sealing method
Plastic mold
Mounting height
2.25 mm MAX
Weight
0.10 g
Code
(Reference)
P-SOP8-5.3
×
6.35-1.27
8-pin plastic SOP
(FPT-8P-M01)
(FPT-8P-M01)
C
2002 FUJITSU LIMITED F08002S-c-6-7
0.13(.005)
M
Details of "A" part
2.00
.079
7.80±0.40
5.30±0.30
(.209±.012) (.307±.016)
.250
–.008
+.010
–0.20
+0.25
6.35
INDEX
1.27(.050)
0.10(.004)
1
4
5
8
0.47±0.08
(.019±.003)
–0.04
+.001
+0.03
0.17
.007
"A"
0.25(.010)
(Stand off)
0~8
(Mounting height)
+0.25
+.010
–.006
0.50±0.20
(.020±.008)
0.60±0.15
(.024±.006)
0.10
.004
+0.10
+.004
–.002
*
1
*
2
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
FPT-8P-M01
0212
Note 1)
*
1 : These dimensions include resin protrusion.
Note 2)
*
2 : These dimensions do not include resin protrusion.
Note 3) Pins width and pins thickness include plating thickness.
Note 4) Pins width do not include tie bar cutting remainder.
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