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參數(shù)資料
| 型號： | FPT-8P-M02 |
| 廠商： | Fujitsu Limited |
| 英文描述： | SMALL OUTLINE L-LEADED PACKAGE 8 PIN PLASTIC |
| 中文描述： | 小外形L -引線封裝8引腳塑料 |
| 文件頁數(shù)： | 1/1頁 |
| 文件大小： | 32K |
| 代理商： | FPT-8P-M02 |
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales representatives before ordering.
FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document.
FUJITSU SEMICONDUCTOR
DATA SHEET
SMALL OUTLINE L-LEADED PACKAGE
8 PIN PLASTIC
8-pin plastic SOP
Lead pitch
1.27 mm
Package width
×
package length
3.9
×
5.05 mm
Lead shape
Gullwing
Sealing method
Plastic mold
Mounting height
1.75 mm MAX
Weight
0.06 g
8-pin plastic SOP
(FPT-8P-M02)
(FPT-8P-M02)
C
2002 FUJITSU LIMITED F08004S-c-4-7
1.27(.050)
3.90±0.30
(.154±.012) (.236±.016)
6.00±0.40
.199
–.008
+.010
–0.20
+0.25
5.05
0.13(.005)
M
0.10(.004)
1
4
5
8
0.44±0.08
(.017±.003)
–0.07
+.001
+0.03
0.22
.009
45
0.40(.016)
"A"
0~8
0.25(.010)
(Mounting height)
Details of "A" part
1.55±0.20
(.061±.008)
0.50±0.20
(.020±.008)
0.60±0.15
(.024±.006)
0.15±0.10
(.006±.004)
(Stand off)
*
1
*
2
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
FPT-8P-M02
0212
Note 1)
*
1 : These dimensions include resin protrusion.
Note 2)
*
2 : These dimensions do not include resin protrusion.
Note 3) Pins width and pins thickness include plating thickness.
Note 4) Pins width do not include tie bar cutting remainder.
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