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| 型號： | FLIP |
| 英文描述： | Flip Chip TVS Evaluation and Assembly Guide (101k) |
| 中文描述： | 倒裝芯片二極管評價和大會指南（101k） |
| 文件頁數(shù)： | 2/3頁 |
| 文件大小： | 101K |
| 代理商： | FLIP |
2
2001 Semtech Corp.
www.semtech.com
PROTECTION PRODUCTS
SI00-06
Surging Ideas
TVS Diode Application Note
solder mask/ball interface is eliminated.
The traces to the pads should be 0.100 mm or less and
1 oz copper layer thickness. Large traces can lead to
excess solder wicking on one side of the component
resulting in “tombstoning” (leaning to one side) of the
component.
Board Finish
A uniform board finish is critical for good assembly
yield. Two finishes that provide uniform surface
coatings are immersion nickel gold and organic surface
protectant (OSP). A non-uniform finish such as hot air
solder leveling (HASL) can lead to mounting problems
and should be avoided. If a gold finish is used, the
thickness of the immersion gold should be kept to less
than 0.5 micron in order to avoid solder joint
embrittlement.
Board Assembly
Initially, OSP finished boards were used and were
assembled without solder paste. A water soluble,
tacky flux was used to mount the devices to the board.
Other assembly variations that Semtech has evaluated
are OSP finish with solder paste, immersion gold with
solder paste, immersion gold with flux, and fused tin/
lead with solder paste. In cases where solder paste is
used, a paste with a Sn62/Pb36/Ag2 or Sn62.8/
Pb36.8/Ag0.4 composition and type 4 or finer powder
is recommended. The small amount of silver
impregnation is recommended for slowing the eutectic
transition point and thus reducing the possibility of
tombstoning. Some experimentation may be required
Figure 2 - NSMD Package Footprint
Figure 3 - Stencil Design
Table 1 - Summary of assembly information for SFC05-4 CSP TVS
Copper Pad Dimension
0.200mm, round
Copper pad Definition
Non solder mask defined (NSMD)
Copper Pad Pitch
0.500mm
Solder Mask Opening
0.3500mm
Soldering Stencil Thickness
0.100mm
Soldering Stencil Aperture Opening
0.275mm Square with rounded corners
Soldering Stencil Fabrication Method
Laser cut, electro-polished
Solder Paste Specification
Type 4,
Sn62/Pb36/Ag2 or Sn62.8/Pb36.8/Ag0.4
Flux Specification
No Clean or tacky, water-soluble
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