參數(shù)資料
型號： FDS8874
廠商： FAIRCHILD SEMICONDUCTOR CORP
元件分類： JFETs
英文描述： N-Channel PowerTrench MOSFET
中文描述： 16 A, 30 V, 0.0055 ohm, N-CHANNEL, Si, POWER, MOSFET
封裝： ROHS COMPLIANT, SOP-8
文件頁數(shù)： 2/11頁
文件大?。?/td> 2556K
代理商： FDS8874
F
FDS8874 Rev. A
www.fairchildsemi.com
2
Electrical Characteristics
T
A
= 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
B
VDSS
Drain to Source Breakdown Voltage
I
D
= 250
μ
A, V
GS
= 0V
V
DS
= 24V
V
GS
= 0V
V
GS
=
±
20V
30
-
-
-
-
-
-
-
-
1
V
I
DSS
Zero Gate Voltage Drain Current
μ
A
T
A
= 150
o
C
250
±
100
I
GSS
Gate to Source Leakage Current
nA
On Characteristics
V
GS(TH)
Gate to Source Threshold Voltage
V
GS
= V
DS
, I
D
= 250
μ
A
I
D
= 16A, V
GS
= 10V
I
D
= 15A, V
GS
= 4.5V
I
D
= 16A, V
GS
= 10V,
T
A
= 150
o
C
1.2
-
-
-
2.5
V
r
DS(ON)
Drain to Source On Resistance
0.004
5
0.0056
0.0055
0.007
-
0.0078
0.0102
Dynamic Characteristics
C
ISS
C
OSS
C
RSS
R
G
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge
Total Gate Charge
Gate to Source Gate Charge
Gate Charge Threshold to Plateau
Gate to Drain “Miller” Charge
V
DS
= 15V, V
GS
= 0V,
f = 1MHz
-
-
-
3000
600
350
1.
6
56
30
8.0
5.0
10
3990
800
525
4.0
72
38
-
-
-
pF
pF
pF
f = 1MHz
V
GS
= 10V
V
GS
= 5V
0.4
-
-
-
-
-
Q
g
V
DD
= 15V
I
D
= 16A
nC
nC
nC
nC
nC
Q
gs
Q
gs2
Q
gd
Switching Characteristics
(V
GS
= 10V)
t
ON
Turn-On Time
t
d(ON)
Turn-On Delay Time
t
r
Rise Time
t
d(OFF)
Turn-Off Delay Time
t
f
Fall Time
t
OFF
Turn-Off Time
V
DD
= 15V, I
D
= 16A
V
GS
= 10V, R
GS
= 4.7
-
-
-
-
-
-
-
9
81
-
-
-
-
111
ns
ns
ns
ns
ns
ns
45
54
20
-
Drain-Source Diode Characteristics
V
SD
Source to Drain Diode Voltage
I
SD
= 16A
I
SD
= 2.1A
I
SD
= 16A, dI
SD
/dt = 100A/
μ
s
I
SD
= 16A, dI
SD
/dt = 100A/
μ
s
-
-
-
-
-
-
-
-
1.25
1.0
28
13
V
V
ns
nC
t
rr
Q
RR
Reverse Recovery Time
Reverse Recovered Charge
Notes:
1:
Starting T
= 25°C, L = 1mH, I
= 23A, V
= 30V, V
= 10V.
2:
R
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the
drain pins. R
is guaranteed by design while R
is determined by the user’s board design.
3:
R
θ
JA
is measured with 1.0 in
copper on FR-4 board
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