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| 型號(hào)： | EVAL-SSM2517Z |
| 廠商： | Analog Devices Inc |
| 文件頁(yè)數(shù)： | 13/16頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | BOARD EVALUATION FOR SSM2517 |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | * |
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SSM2517
Data Sheet
Rev. B | Page 6 of 16
ABSOLUTE MAXIMUM RATINGS
Absolute maximum ratings apply at 25°C, unless otherwise noted.
Table 4.
Parameter
Rating
PVDD Supply Voltage
0.3 V to +6 V
VDD Supply Voltage
0.3 V to +3.6 V
Input Voltage (Signal Source)
0.3 V to +3.6 V
ESD Susceptibility
4 kV
OUT and OUT+ Pins
8 kV
Storage Temperature Range
65°C to +150°C
Operating Temperature Range
40°C to +85°C
Junction Temperature Range
65°C to +165°C
Lead Temperature (Soldering, 60 sec)
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Junction-to-air thermal resistance (θJA) is specified for the worst-
case conditions, that is, a device soldered in a printed circuit board
(PCB) for surface-mount packages. θJA and θJB (junction-to-board
thermal resistance) are determined according to JEDEC JESD51-9
on a 4-layer PCB with natural convection cooling.
Table 5. Thermal Resistance
Package Type
PCB
θJA
θJB
Unit
9-Ball, 1.5 mm × 1.5 mm WLCSP
1S0P
162
39
°C/W
2S0P
76
21
°C/W
ESD CAUTION
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