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參數資料
| 型號： | EVAL-ADMP521Z |
| 廠商： | Analog Devices Inc |
| 文件頁數： | 4/17頁 |
| 文件大?。?/td> | 0K |
| 描述： | BOARD EVAL FOR ADMP521Z |
| 標準包裝： | 1 |
| 系列： | iMEMS® |
| 主要目的： | 音頻，MEMS 全向麥克風 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | ADMP521 |
| 主要屬性： | 數字輸出 |
| 已供物品： | 板 |
Data Sheet
ADMP521
Rev. A | Page 11 of 16
PCB DESIGN AND LAYOUT
The recommended PCB land pattern for the ADMP521 should
be laid out to a 1:1 ratio to the solder pads on the microphone
package, as shown in Figure 15. Take care to avoid applying solder
paste to the sound hole in the PCB. A suggested solder paste
stencil pattern layout is shown in Figure 16.
The response of the ADMP521 is not affected by the PCB hole
size as long as the hole is not smaller than the sound port of the
microphone (0.25 mm, or 0.010”, in diameter). A 0.5 mm to 1 mm
(0.020 inch to 0.040 inch) diameter for the hole is recommended.
Take care to align the hole in the microphone package with the
hole in the PCB. The exact degree of the alignment does not affect
the microphone performance as long as the holes are not partially
or completely blocked.
4× 0.40 × 0.60
(0.30)
0.90
(0.30)
1.70
3.80
(0.30)
0.35
2.80
2× R0.10
(0.30)
0.35
2.05
0.70
1.10
101
41-
0
09
(1.000)
(0.550)
CENTER LINE
Figure 15. Suggested PCB Land Pattern Layout
101
41
-010
1.45
0.9
2.45
0.7
1.525
1.000
0.35
1.849
1.498
0.205 WIDE
0.248 × 0.498 (2×)
0.248 × 1.148 (2×)
0.248 × 0.948 (2×)
1.498 × 0.248
0.398 × 0.298 (4×)
0.362 CUT (3×)
1.17
24°
0.375
CENTER
LINE
Figure 16. Suggested Solder Paste Stencil Pattern Layout
OBSOLETE
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相關代理商/技術參數 |
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|---|---|
| EVAL-ADMP521Z-FLEX | 功能描述:BOARD EVAL FOR ADMP521Z RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 評估演示板和套件 系列:iMEMS® 標準包裝:1 系列:PSoC® 主要目的:電源管理，熱管理 嵌入式:- 已用 IC / 零件:- 主要屬性:- 次要屬性:- 已供物品:板，CD，電源 |
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| EVAL-ADN2525-NTZ | 制造商:Analog Devices 功能描述:OPTICAL EVAL KIT FOR THE ADN2525 - Bulk |
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