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參數(shù)資料
| 型號(hào)： | EVAL-ADF4113HVEB1Z |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 8/20頁 |
| 文件大?。?/td> | 0K |
| 描述： | BOARD EVALUATION FOR ADF4113HV |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 主要目的： | 計(jì)時(shí)，頻率合成器 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | ADF4113HV |
| 主要屬性： | 單路整數(shù)-N PLL |
| 次要屬性： | 4GHz 高壓充電泵 |
| 已供物品： | 板 |
| 相關(guān)產(chǎn)品： | ADF4113BCPZ-ND - IC PLL FREQ SYNTHESIZER 20-LFCSP ADF4113BCPZ-RL7-ND - IC PLL FREQ SYNTHESIZER 20-LFCSP ADF4113BCPZ-RL-ND - IC PLL FREQ SYNTHESIZER 20-LFCSP ADF4113HVBRUZ-RL7-ND - IC CHARGE PUMP HV SYNTH 16-TSSOP ADF4113HVBRUZ-RL-ND - IC CHARGE PUMP HV SYNTH 16-TSSOP ADF4113HVBCPZ-RL7-ND - IC CHARGE PUMP HV SYNTH 20-LFCSP ADF4113HVBCPZ-RL-ND - IC CHARGE PUMP HV SYNTH 20-LFCSP ADF4113HVBRUZ-ND - IC CHARGE PUMP HV SYNTH 16-TSSOP ADF4113HVBCPZ-ND - IC CHARGE PUMP HV SYNTH 20-LFCSP ADF4113BRUZ-REEL7TR-ND - IC SYNTHESZR FREQ PLL RF 16TSSOP 更多... |
ADF4113HV
Data Sheet
Rev. B | Page 16 of 20
ADSP-21xx Interface
Figure 25 shows the interface between the ADF4113HV and the
ADSP-21xx digital signal processor. The ADF4113HV needs a
24-bit serial word for each latch write. The easiest way to
accomplish this using the ADSP-21xx family is to use the auto
buffered transmit mode of operation with alternate framing.
This provides a means for transmitting an entire block of serial
data before an interrupt is generated.
SCLK
DT
I/O FLAGS
ADSP-21xx
CLK
DATA
LE
CE
MUXOUT
(LOCK DETECT)
ADF4113HV
TFS
06223-
025
Figure 25. ADSP-21xx to ADF4113HV Interface
Set up the word length for eight bits and use three memory
locations for each 24-bit word. To program each 24-bit latch,
store the three 8-bit bytes, enable the auto buffered mode, and
then write to the transmit register of the DSP. This last opera-
tion initiates the autobuffer transfer.
PCB DESIGN GUIDELINES FOR CHIP SCALE
PACKAGE
The lands on the chip scale package (CP-20-6) are rectangular.
The printed circuit board pad for these should be 0.1 mm
longer than the package land length, and 0.05 mm wider than
the package land width. The land should be centered on the pad
to ensure that the solder joint size is maximized.
The bottom of the chip scale package has a central thermal pad.
The thermal pad on the printed circuit board should be at least
as large as this exposed pad. On the printed circuit board, provide
a clearance of at least 0.25 mm between the thermal pad and the
inner edges of the pad pattern. This ensures that shorting is
avoided.
Thermal vias can be used on the printed circuit board thermal
pad to improve thermal performance of the package. If vias are
used, they should be incorporated in the thermal pad at a 1.2 mm
pitch grid. The via diameter should be between 0.3 mm and
0.33 mm, and the via barrel should be plated with 1 oz. copper
to plug the via.
The user should connect the printed circuit board thermal pad
to AGND.
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