參數(shù)資料
型號(hào)： EDL1216CASA-10
英文描述： Programmable VCOM; Temperature Range: -40°C to 85°C; Package: 24-QFN
中文描述： 內(nèi)存| 4X2MX16 |的CMOS | BGA封裝| 54PIN |塑料
文件頁(yè)數(shù)： 23/59頁(yè)
文件大小： 489K
代理商： EDL1216CASA-10
EDL1216AASA
Data Sheet E0196E20 (Ver. 2.0)
3
CONTENTS
Description .................................................................................................................................................... 1
Features ........................................................................................................................................................ 1
Applications ................................................................................................................................................... 1
Pin Configurations ......................................................................................................................................... 1
Ordering Information ..................................................................................................................................... 2
Electrical Specifications................................................................................................................................. 4
Pin Function .................................................................................................................................................. 9
Command Operation ................................................................................................................................... 10
Truth Table .................................................................................................................................................. 14
Simplified State Diagram............................................................................................................................. 19
Initialization.................................................................................................................................................. 20
Programming Mode Registers .................................................................................................................... 20
Address Bits of Bank-Select and Precharge ............................................................................................... 24
Operation of the Mobile RAM ...................................................................................................................... 25
Timing Waveforms ...................................................................................................................................... 33
Package Drawing ........................................................................................................................................ 56
Recommended Soldering Conditions.......................................................................................................... 57
Revision History .......................................................................................................................................... 60
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