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參數(shù)資料
| 型號(hào)： | ECM807 |
| 文件頁(yè)數(shù)： | 9/14頁(yè) |
| 文件大?。?/td> | 178K |
| 代理商： | ECM807 |
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EiC Corp. A Subsidiary of EiC Enterprises, Ltd.
45738 Northport Loop West, Fremont, CA 94538
Phone: (510) 979-8999
Fax: (510) 979-8902
www.eiccorp.com
4
ECM806
6 x 6 mm Dual Mode Cellular TDMA/AMPS
3.5V POWER AMPLIFIER MODULE
PRELIMINARY DATA SHEET
SS-000489-000
Revision J
Package Dimensions
The ECM806 is a laminate base, overmold encapsulated modular package designed for surface-mounted
solder attachment to a printed circuit board.
PACKAGE DIMENSIONS AND MARKINGS
Device Marking
.062" +/- .004"
(1.57 mm +/-0.10 mm)
EiC xxxx
.232" +/- 0.004"
(5.89mm +/- 0.1mm)
ECM806
.232"
+/-
0.004"
(5.89mm
+/-
0.1mm)
XXXX XXXX
LOT NUMBER
PIN 1 INDICATOR
TOP VIEW WITH MARKING DIAGRAM
7
6
5
4
Vcc2
RFout
GND
2
RFin
PINOUT
1
Vcc1
3VPD
Y3
Y1
Y
X3
X2
X1
X
3.63
3.53
3.73
.143
.147
.139
millimeters
max
nom
max
min
5.89
5.99
5.78
inches
.228
.232
.236
.228
.232
.236
.047
.094
.095
.051
.043
.098
.090
.099
.091
.095
.091
.099
2.41
1.19
2.39
2.41
2.51
2.31
2.49
2.29
1.29
1.09
2.51
2.31
Y2
.075
.079
.071
1.91
1.81
2.01
Metric values are converted from English values.
Metric values are rounded off.
3
Y3
2
Y2
1
X3
X2
4
5
7
Y
Y1
X1
X
6
BOTTOM SIDE GROUND PAD
BOTTOM SIDE PAD
.036" X .030"
(.91mm X .76mm)
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相關(guān)代理商/技術(shù)參數(shù) |
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| ECM91SMX | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:ECM Surface Mount Crystal |
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