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56F827 Technical Data
Figure 10. Flash Mass Erase Cycle
3.6 External Clock Operation
The 56F827 system clock can be derived from a crystal or an external system clock signal. To generate a
reference frequency using the internal oscillator, a reference crystal must be connected between the EXTAL
and XTAL pins.
3.6.1
Crystal Oscillator
The internal oscillator is also designed to interface with a parallel-resonant crystal resonator in the
frequency range specified for the external crystal in
Table 11
.
A recommended crystal oscillator circuit is
shown in
Figure 11
.
Follow the crystal supplier’s recommendations when selecting a crystal, because
crystal parameters determine the component values required to provide maximum stability and reliable
start-up. The crystal and associated components should be mounted as close as possible to the EXTAL and
XTAL pins to minimize output distortion and start-up stabilization time.The internal 56F82x oscillator
circuitry is designed to have no external load capacitors present. As shown in
Figure 11
,
no external load
capacitors should be used.
The 56F80x components internally are modeled as a parallel resonant oscillator circuit to provide a
capacitive load on each of the oscillator pins (XTAL and EXTAL) of 10pF to 13pF over temperature and
process variations. Using a typical value of internal capacitance on these pins of 12pF and a value of 3pF as
a typical circuit board trace capacitance the parallel load capacitance presented to the crystal is 9pF as
determined by the following equation:
XADR
YE=SE=OE=0
ERASE
NVSTR
Tnvs
Tnvh1
Trcv
Tme
MAS1
IFREN
XE
CL =
CL1 * CL2
CL1 + CL2
+ Cs =
+ 3 = 6 + 3 = 9pF
12 * 12
12 + 12
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.