參數(shù)資料
型號: DS21FF44
廠商: Maxim Integrated Products
文件頁數(shù): 21/117頁
文件大?。?/td> 0K
描述: IC FRAMER E1 4X4 16CH 300-BGA
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 40
控制器類型: E1 調(diào)幀器
接口: 并行/串行
電源電壓: 2.97 V ~ 3.63 V
電流 - 電源: 300mA
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 300-BBGA
供應(yīng)商設(shè)備封裝: 300-PBGA(27x27)
包裝: 管件
DS21FT44/DS21FF44
117 of 117
POWER SUPPLY DECOUPLING
In a typical PCB layout for the MCM, all of the VDD pins will connect to a common power plane and all
the VSS lines will connect to a common ground plane. The recommended method for decoupling is
shown below in both schematic and pictorial form. As shown in the pictorial, the capacitors should be
symmetrically located about the device. Figure 24-1 uses standard capacitors, two .47 uf ceramics and
two .01uf ceramics. Since VDD and VSS signals will typically pass vertically to the power and ground
planes of a PCB, the decoupling caps must be placed as close to the DS21Fx4y as possible and routed
vertically to power and ground planes.
Figure 24-1. DECOUPLING SCHEME USING STANDARD TANTALUM CAPS
.01
VDD
DS21Fx4y
.47
.01
.47
DS21Fx4y
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