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鍙冩暩(sh霉)璩囨枡
鍨嬭櫉(h脿o)锛� DS1340C-3#
寤�(ch菐ng)鍟嗭細 Maxim Integrated Products
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鎻忚堪锛� IC RTC I2C W/CHARGER 16-SOIC
鐢�(ch菐n)鍝佸煿瑷�(x霉n)妯″锛� Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
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椤�(l猫i)鍨嬶細 鏅�(sh铆)閻�/鏃ユ
鐗归粸(di菐n)锛� 闁忓勾锛屾柟娉㈣几鍑�锛屾稉娴佸厖闆诲櫒
鏅�(sh铆)闁撴牸寮忥細 HH:MM:SS锛�24 灏忔檪(sh铆)锛�
鏁�(sh霉)鎿�(j霉)鏍煎紡锛� YY-MM-DD-dd
鎺ュ彛锛� I²C锛�2 绶�(xi脿n)涓插彛
闆绘簮闆诲锛� 2.7 V ~ 5.5 V
闆诲 - 闆绘簮锛岄浕姹狅細 1.3 V ~ 3.7 V
宸ヤ綔婧害锛� -40°C ~ 85°C
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I2C RTC with Trickle Charger
14
Maxim Integrated
DS1340
Chip Information
PROCESS: CMOS
SUBSTRATE CONNECTED TO GROUND
Thermal Information
Theta-JA: 170掳C/W (0.150in SO)
Theta-JC: 40掳C/W (0.150in SO)
Theta-JA: 221掳C/W (SOP)
Theta-JC: 39掳C/W (SOP)
Theta-JA: 89.6掳C/W (0.300in SO)
Theta-JC: 24.8掳C/W (0.300in SO)
Handling, PC Board Layout,
and Assembly
The DS1340C package contains a quartz tuning-fork
crystal. Pick-and-place equipment may be used, but
precautions should be taken to ensure that excessive
shocks are avoided. Exposure to reflow is limited to 2
times maximum. Ultrasonic cleaning should be avoided
to prevent damage to the crystal.
Avoid running signal traces under the package, unless
a ground plane is placed between the package and the
signal line. All N.C. (no connect) pins must be connect-
ed to ground.
Moisture-sensitive packages are shipped from the facto-
ry dry-packed.Handling instructions listed on the pack-
age label must be followed to prevent damage during
reflow. Refer to the IPC/JEDEC J-STD-020 standard for
moisture-sensitive device (MSD) classifications.
1
2
3
4
8
7
6
5
VCC
FT/OUT
SCL
SDA
VBACKUP
GND
X2
X1
TOP VIEW
SO,
渭SOP
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
SCL
SDA
GND
VBACKUP
N.C.
SO (300 mils)
FT/OUT
VCC
N.C.
DS1340
DS1340C
Pin Configurations
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE NO.
LAND
PATTERN NO.
8 SO (150 mils)
S8+2
8 SOP
U8+1
16 SO (300 mils)
W16#H2
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a 鈥�+鈥�, 鈥�#鈥�, or 鈥�-鈥� in the package code indicates RoHS status
only. Package drawings may show a different suffix character,
but the drawing pertains to the package regardless of RoHS status.
鐩搁棞(gu膩n)PDF璩囨枡
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鐩搁棞(gu膩n)浠g悊鍟�/鎶€琛�(sh霉)鍙冩暩(sh霉)
鍙冩暩(sh霉)鎻忚堪
DS1340C-3# 鍔熻兘鎻忚堪:瀵�(sh铆)鏅�(sh铆)鏅�(sh铆)閻� I2C RTC w/Trickle Charger RoHS:鍚� 鍒堕€犲晢:Microchip Technology 鍔熻兘:Clock, Calendar. Alarm RTC 绺界窔(xi脿n)鎺ュ彛:I2C 鏃ユ湡鏍煎紡:DW:DM:M:Y 鏅�(sh铆)闁撴牸寮�:HH:MM:SS RTC 瀛樺劜(ch菙)瀹归噺:64 B 闆绘簮闆诲-鏈€澶�:5.5 V 闆绘簮闆诲-鏈€灏�:1.8 V 鏈€澶у伐浣滄韩搴�:+ 85 C 鏈€灏忓伐浣滄韩搴�: 瀹夎棰�(f膿ng)鏍�:Through Hole 灏佽 / 绠遍珨:PDIP-8 灏佽:Tube
DS1340C-3+ 鍒堕€犲晢:MAXIM 鍒堕€犲晢鍏ㄧū(ch膿ng):Maxim Integrated Products 鍔熻兘鎻忚堪:I2C RTC with Trickle Charger
DS1340C-33 鍔熻兘鎻忚堪:瀵�(sh铆)鏅�(sh铆)鏅�(sh铆)閻� RoHS:鍚� 鍒堕€犲晢:Microchip Technology 鍔熻兘:Clock, Calendar. Alarm RTC 绺界窔(xi脿n)鎺ュ彛:I2C 鏃ユ湡鏍煎紡:DW:DM:M:Y 鏅�(sh铆)闁撴牸寮�:HH:MM:SS RTC 瀛樺劜(ch菙)瀹归噺:64 B 闆绘簮闆诲-鏈€澶�:5.5 V 闆绘簮闆诲-鏈€灏�:1.8 V 鏈€澶у伐浣滄韩搴�:+ 85 C 鏈€灏忓伐浣滄韩搴�: 瀹夎棰�(f膿ng)鏍�:Through Hole 灏佽 / 绠遍珨:PDIP-8 灏佽:Tube
DS1340C-33- 鍒堕€犲晢:MAXIM 鍒堕€犲晢鍏ㄧū(ch膿ng):Maxim Integrated Products 鍔熻兘鎻忚堪:I2C RTC with Trickle Charger
DS1340C-33# 鍔熻兘鎻忚堪:瀵�(sh铆)鏅�(sh铆)鏅�(sh铆)閻� I2C RTC w/Trickle Charger RoHS:鍚� 鍒堕€犲晢:Microchip Technology 鍔熻兘:Clock, Calendar. Alarm RTC 绺界窔(xi脿n)鎺ュ彛:I2C 鏃ユ湡鏍煎紡:DW:DM:M:Y 鏅�(sh铆)闁撴牸寮�:HH:MM:SS RTC 瀛樺劜(ch菙)瀹归噺:64 B 闆绘簮闆诲-鏈€澶�:5.5 V 闆绘簮闆诲-鏈€灏�:1.8 V 鏈€澶у伐浣滄韩搴�:+ 85 C 鏈€灏忓伐浣滄韩搴�: 瀹夎棰�(f膿ng)鏍�:Through Hole 灏佽 / 绠遍珨:PDIP-8 灏佽:Tube