I2C RTC with Trickle Charger Maxim Integrated 7 DS1340 when V
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I2C RTC with Trickle Charger
Maxim Integrated
7
DS1340
when VCC drops below VBACKUP. The registers are
maintained from the VBACKUP source until VCC is
returned to nominal levels (Table 1). After VCC returns
above VPF, read and write access is allowed tREC.
Oscillator Circuit
The DS1340 uses an external 32.768kHz crystal. The
oscillator circuit does not require any external resistors
or capacitors to operate. Table 2 specifies several crys-
tal parameters for the external crystal. Figure 3 shows a
functional schematic of the oscillator circuit. If using a
crystal with the specified characteristics, the startup
time is usually less than one second.
Clock Accuracy
The initial clock accuracy depends on the accuracy of
the crystal and the accuracy of the match between the
capacitive load of the oscillator circuit and the capaci-
tive load for which the crystal was trimmed. Additional
error is added by crystal frequency drift caused by
temperature shifts. External circuit noise coupled into
the oscillator circuit can result in the clock running fast.
Figure 4 shows a typical PC board layout for isolating
the crystal and oscillator from noise. Refer to
Application Note 58: Crystal Considerations with Dallas
Real-Time Clocks (www.maximintegrated.com/RTCapps)
for detailed information.
DS1340C Only
The DS1340C integrates a standard 32,768Hz crystal
into the package. Typical accuracy with nominal VCC
and +25掳C is approximately +15ppm. Refer to
Application Note 58 for information about crystal accu-
racy vs. temperature.
Operation
The DS1340 operates as a slave device on the serial
bus. Access is obtained by implementing a START
condition and providing a device identification code fol-
lowed by data. Subsequent registers can be accessed
sequentially until a STOP condition is executed. The
device is fully accessible and data can be written and
read when VCC is greater than VPF. However, when
VCC falls below VPF, the internal clock registers are
blocked from any access. If VPF is less than VBACKUP,
the device power is switched from VCC to VBACKUP
when VCC drops below VPF. If VPF is greater than
VBACKUP, the device power is switched from VCC to
VBACKUP when VCC drops below VBACKUP. The regis-
ters are maintained from the VBACKUP source until VCC
is returned to nominal levels. The functional diagram
(Figure 5) shows the main elements of the serial RTC.
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
Nominal
Frequency
fO
32.768
kHz
Series Resistance
ESR
80
k
Load Capacitance
CL
12.5
pF
Table 2. Crystal Specifications*
*
The crystal, traces, and crystal input pins should be isolated
from RF generating signals. Refer to Application Note 58:
Crystal Considerations for Dallas Real-Time Clocks
for addi-
tional specifications.
COUNTDOWN
CHAIN
RTC
X1
X2
CL1
CL2
CRYSTAL
RTC
REGISTERS
Figure 3. Oscillator Circuit Showing Internal Bias Network
CRYSTAL
X1
X2
GND
LOCAL GROUND PLANE (LAYER 2)
Figure 4. Layout Example
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DS1340C-3# 鍔熻兘鎻忚堪:瀵�(sh铆)鏅�(sh铆)鏅�(sh铆)閻� I2C RTC w/Trickle Charger RoHS:鍚� 鍒堕€犲晢:Microchip Technology 鍔熻兘:Clock, Calendar. Alarm RTC 绺界窔鎺ュ彛:I2C 鏃ユ湡鏍煎紡:DW:DM:M:Y 鏅�(sh铆)闁撴牸寮�:HH:MM:SS RTC 瀛樺劜(ch菙)瀹归噺:64 B 闆绘簮闆诲-鏈€澶�:5.5 V 闆绘簮闆诲-鏈€灏�:1.8 V 鏈€澶у伐浣滄韩搴�:+ 85 C 鏈€灏忓伐浣滄韩搴�: 瀹夎棰�(f膿ng)鏍�:Through Hole 灏佽 / 绠遍珨:PDIP-8 灏佽:Tube
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DS1340C-33- 鍒堕€犲晢:MAXIM 鍒堕€犲晢鍏ㄧū:Maxim Integrated Products 鍔熻兘鎻忚堪:I2C RTC with Trickle Charger
DS1340C-33# 鍔熻兘鎻忚堪:瀵�(sh铆)鏅�(sh铆)鏅�(sh铆)閻� I2C RTC w/Trickle Charger RoHS:鍚� 鍒堕€犲晢:Microchip Technology 鍔熻兘:Clock, Calendar. Alarm RTC 绺界窔鎺ュ彛:I2C 鏃ユ湡鏍煎紡:DW:DM:M:Y 鏅�(sh铆)闁撴牸寮�:HH:MM:SS RTC 瀛樺劜(ch菙)瀹归噺:64 B 闆绘簮闆诲-鏈€澶�:5.5 V 闆绘簮闆诲-鏈€灏�:1.8 V 鏈€澶у伐浣滄韩搴�:+ 85 C 鏈€灏忓伐浣滄韩搴�: 瀹夎棰�(f膿ng)鏍�:Through Hole 灏佽 / 绠遍珨:PDIP-8 灏佽:Tube