- 鎮ㄧ従(xi脿n)鍦ㄧ殑浣嶇疆锛�璨疯常IC缍�(w菐ng) > PDF鐩寗9359 > DS1338C-18# (Maxim Integrated Products)IC RTC 56BIT NV SRAM 16-SOIC PDF璩囨枡涓嬭級
鍙冩暩(sh霉)璩囨枡
| 鍨嬭櫉锛� | DS1338C-18# |
| 寤犲晢锛� | Maxim Integrated Products |
| 鏂囦欢闋佹暩(sh霉)锛� | 7/16闋� |
| 鏂囦欢澶�?銆�?/td> | 0K |
| 鎻忚堪锛� | IC RTC 56BIT NV SRAM 16-SOIC |
| 鐢�(ch菐n)鍝佸煿瑷�(x霉n)妯″锛� | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 妯�(bi膩o)婧�(zh菙n)鍖呰锛� | 45 |
| 椤炲瀷锛� | 鏅傞悩/鏃ユ |
| 鐗归粸(di菐n)锛� | 闁忓勾锛孨VSRAM锛屾柟娉㈣几鍑� |
| 瀛樺劜瀹归噺锛� | 56B |
| 鏅傞枔鏍煎紡锛� | HH:MM:SS锛�12/24 灏忔檪锛� |
| 鏁�(sh霉)鎿�(j霉)鏍煎紡锛� | YY-MM-DD-dd |
| 鎺ュ彛锛� | I²C锛�2 绶氫覆鍙� |
| 闆绘簮闆诲锛� | 1.71 V ~ 5.5 V |
| 闆诲 - 闆绘簮锛岄浕姹狅細 | 1.3 V ~ 3.7 V |
| 宸ヤ綔婧害锛� | -40°C ~ 85°C |
| 瀹夎椤炲瀷锛� | 琛ㄩ潰璨艰 |
| 灏佽/澶栨锛� | 16-SOIC锛�0.295"锛�7.50mm 瀵級 |
| 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁濓細 | 16-SOIC W |
| 鍖呰锛� | 绠′欢 |
DS1338 I2C RTC with 56-Byte NV RAM
15 of 16
HANDLING, PCB LAYOUT, AND ASSEMBLY
The DS1338C package contains a quartz tuning-fork crystal. Pick-and-place equipment may be used, but
precautions should be taken to ensure that excessive shocks are avoided. Ultrasonic cleaning should be avoided to
prevent damage to the crystal. Exposure to reflow is limited to 2 times maximum.
Avoid running signal traces under the package, unless a ground plane is placed between the package and the
signal line. All N.C. (no connect) pins must be connected to ground.
The RoHS and lead-free/RoHS packages may be reflowed using a reflow profile that complies with JEDEC J-STD-
020.
Moisture-sensitive packages are shipped from the factory dry-packed. Handling instructions listed on the package
label must be followed to prevent damage during reflow. Refer to the IPC/JEDEC J-STD-020 standard for moisture-
sensitive device (MSD) classifications.
PIN CONFIGURATIONS
CHIP INFORMATION
TRANSISTOR COUNT: 12,231
PROCESS: CMOS
THERMAL INFORMATION
PART
THETA-JA
(掳C/W)
THETA-JC
(掳C/W)
8 SO
132
38
8 渭SOP
206.3
42
16 SO
73
23
PACKAGE INFORMATION
For the latest package outline information and land patterns (footprints), go to
Note that a 鈥�+鈥�, 鈥�#鈥�, or 鈥�-鈥� in the package code indicates RoHS status only. Package drawings may show a different
suffix character, but the drawing pertains to the package regardless of RoHS status.
PACKAGE TYPE
PACKAGE CODE
OUTLINE NO.
LAND PATTERN NO.
8 SO
S8+4
8 MAX
U8+1
16 SO
W16#H2
SO, 渭SOP
SQW/OUT
1
2
3
4
8
7
6
5
X1
X2
VBAT
GND
VCC
SCL
SDA
TOP VIEW
SCL
SDA
GND
VBAT
SQW/OUT
Vcc
N.C.
DS1338C
SO (300 mils)
TOP VIEW
D
S13
38
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鍙冩暩(sh霉)鎻忚堪 |
|---|---|
| DS1338C-18# | 鍔熻兘鎻忚堪:瀵�(sh铆)鏅傛檪閻� I2C Serial RTC w/56 Byte NV RAM RoHS:鍚� 鍒堕€犲晢:Microchip Technology 鍔熻兘:Clock, Calendar. Alarm RTC 绺界窔鎺ュ彛:I2C 鏃ユ湡鏍煎紡:DW:DM:M:Y 鏅傞枔鏍煎紡:HH:MM:SS RTC 瀛樺劜瀹归噺:64 B 闆绘簮闆诲-鏈€澶�:5.5 V 闆绘簮闆诲-鏈€灏�:1.8 V 鏈€澶у伐浣滄韩搴�:+ 85 C 鏈€灏忓伐浣滄韩搴�: 瀹夎棰�(f膿ng)鏍�:Through Hole 灏佽 / 绠遍珨:PDIP-8 灏佽:Tube |
| DS1338C-18+ | 鍒堕€犲晢:Maxim Integrated Products 鍔熻兘鎻忚堪:REAL TIME CLOCK SERL 56BYTE 16SOIC - Bulk |
| DS1338C-3 | 鍔熻兘鎻忚堪:瀵�(sh铆)鏅傛檪閻� RoHS:鍚� 鍒堕€犲晢:Microchip Technology 鍔熻兘:Clock, Calendar. Alarm RTC 绺界窔鎺ュ彛:I2C 鏃ユ湡鏍煎紡:DW:DM:M:Y 鏅傞枔鏍煎紡:HH:MM:SS RTC 瀛樺劜瀹归噺:64 B 闆绘簮闆诲-鏈€澶�:5.5 V 闆绘簮闆诲-鏈€灏�:1.8 V 鏈€澶у伐浣滄韩搴�:+ 85 C 鏈€灏忓伐浣滄韩搴�: 瀹夎棰�(f膿ng)鏍�:Through Hole 灏佽 / 绠遍珨:PDIP-8 灏佽:Tube |
| DS1338C-3# | 鍔熻兘鎻忚堪:瀵�(sh铆)鏅傛檪閻� I2C Serial RTC w/56 Byte NV RAM RoHS:鍚� 鍒堕€犲晢:Microchip Technology 鍔熻兘:Clock, Calendar. Alarm RTC 绺界窔鎺ュ彛:I2C 鏃ユ湡鏍煎紡:DW:DM:M:Y 鏅傞枔鏍煎紡:HH:MM:SS RTC 瀛樺劜瀹归噺:64 B 闆绘簮闆诲-鏈€澶�:5.5 V 闆绘簮闆诲-鏈€灏�:1.8 V 鏈€澶у伐浣滄韩搴�:+ 85 C 鏈€灏忓伐浣滄韩搴�: 瀹夎棰�(f膿ng)鏍�:Through Hole 灏佽 / 绠遍珨:PDIP-8 灏佽:Tube |
| DS1338C-3+ | 鍒堕€犲晢:Maxim Integrated Products 鍔熻兘鎻忚堪:REAL TIME CLOCK SERL 56BYTE 16SOIC - Bulk |
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