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參數(shù)資料
| 型號(hào)： | DS1308U-33+T |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 9/16頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC RTC 56BYTE NVRAM I2C 8UMAX |
| 標(biāo)準(zhǔn)包裝： | 3,000 |
| 類型： | 時(shí)鐘/日歷 |
| 特點(diǎn)： | 閏年，NVSRAM，方波輸出 |
| 存儲(chǔ)容量： | 56B |
| 時(shí)間格式： | HH:MM:SS（12/24 小時(shí)） |
| 數(shù)據(jù)格式： | YY-MM-DD-dd |
| 接口： | I²C，2 線串口 |
| 電源電壓： | 3 V ~ 5.5 V |
| 電壓 - 電源，電池： | 1.3 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-TSSOP，8-MSOP（0.118"，3.00mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-uMAX |
| 包裝： | 帶卷 (TR) |
DS1308
Low-Current I2C RTC with 56-Byte NV RAM
2
Maxim Integrated
(All voltages relative to ground.)
Voltage Range on VCC or VBAT ...........................-0.3V to +6.0V
Voltage on Any Non-Power Pin................ -0.3V to (VCC + 0.3V)
Operating Temperature Range.......................... -40NC to +85NC
Junction Temperature Maximum.....................................+150NC
Storage Temperature Range............................ -55NC to +125NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
(TA = -40NC to +85NC, unless otherwise noted.) (Note 2)
DC ELECTRICAL CHARACTERISTICS
(VCC = VCCMIN to VCCMAX, VBAT = VBATMIN to VBATMAX, TA = -40NC to +85NC, unless otherwise noted.) (Note 2)
F
SOP
Junction-to-Ambient Thermal Resistance (BJA) .....206.3NC/W
Junction-to-Case Thermal Resistance (BJC) ...............42NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Operating Voltage Range
VCC
DS1308-18
1.71
1.8
5.5
V
DS1308-3
2.7
3.0
5.5
DS1308-33
3.0
3.3
5.5
Battery Voltage
VBAT
1.3
5.5
V
Logic 1 Input
VIH
0.7 x
VCC
VCC +
0.3
V
Logic 0 Input
VIL
-0.3
0.3 x
VCC
V
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Power-Supply Active Current
(Note 3)
ICCA
fSCL = 400kHz
325
F
A
Power-Supply Standby Current
(Note 4)
ICCS
-33: VCC = 3.63V
125
F
A
-18: VCC = 1.89V
100
VCC = VCCMAX
200
Battery Leakage Current
IBATLKG
VCC R VPF
-100
25
+100
nA
Input Leakage (SCL)
II
VIN = 0V to VCC
-0.1
+0.1
F
A
I/O Leakage (SDA, SQW/CLKIN)
IIO
I2C bus inactive, ECLK = 1
-0.1
+0.1
F
A
Output Logic 0 (SDA, SQW/
CLKIN), VOL = 0.4V
IOL
VCC R VCCMIN
3.0
mA
VBAT R 1.3V R VCC + 0.2V
250
F
A
Power-Fail Trip Point
VPF
-33
2.70
2.82
3.00
V
-18
1.45
1.62
1.70
Switchover Voltage
VSW
VBAT > VPF
VPF
V
VBAT < VPF
VBAT > VCC
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