參數(shù)資料
型號(hào): DS1248Y-70
廠商: DALLAS SEMICONDUCTOR
元件分類(lèi): Timer or RTC
英文描述: 0 TIMER(S), REAL TIME CLOCK, DMA32
封裝: MODULE, DIP-32
文件頁(yè)數(shù): 9/21頁(yè)
文件大?。?/td> 279K
代理商: DS1248Y-70
DS1248/DS1248P
17 of 21
AC TEST CONDITIONS
Output Load:
50 pF + 1TTL Gate
Input Pulse Levels:
0–3V
Timing Measurement Reference Levels
Input:
1.5V
Output:
1.5V
Input Pulse Rise and Fall Times: 5 ns
NOTES:
1.
WE is high for a read cycle.
2. OE = VIH or VIL . If CE = VIH during write cycle, the output buffers remain in a high impedance
state.
3. tWP is specified as the logical AND of CE and WE . tWP is measured from the latter of CE or WE
going low to the earlier of CE or WE going high.
4. tDH , t DS are measured from the earlier of CE or WE going high.
5. These parameters are sampled with a 50 pF load and are not 100% tested.
6. If the CE low transition occurs simultaneously with or later than the WE low transition in Write
Cycle 1, the output buffers remain in a high impedance state during this period.
7. If the CE high transition occurs prior to or simultaneously with the WE high transition, the output
buffers remain in a high impedance state during this period.
8. If WE is low or the WE low transition occurs prior to or simultaneously with the CE low transition,
the output buffers remain in a high impedance state during this period.
9. The expected tDR is defined as cumulative time in the absence of VCC with the clock oscillator
running.
10. tWR is a function of the latter occurring edge of WE or CE .
11. Voltage are referencd to ground.
12. RST (Pin1) has an internal pull–up resistor.
13. Real–Time Clock Modules can be successfully processed through conventional wave–soldering
techniques as long as temperature exposure to the lithium energy source contained within does not
exceed +85°C.
Post solder cleaning with water washing techniques is acceptable, provided that
ultrasonic vibration is not used.
In addition, for the PowerCap:
a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through solder
reflow oriented with the label side up (“l(fā)ive – bug”).
b. Hand Soldering and touch–up: Do not touch or apply the soldering iron to leads for more than
3 (three) seconds.
To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove the part, apply
flux, heat the lead frame pad until the solder reflow and use a solder wick to remove solder.
相關(guān)PDF資料
PDF描述
DS1248YP-70 0 TIMER(S), REAL TIME CLOCK, DMA34
DS1248W-120 REAL TIME CLOCK, PDIP32
DS1248WP-120 REAL TIME CLOCK, DMA34
DS1250ABP-70 512K X 8 NON-VOLATILE SRAM MODULE, 70 ns, DMA34
DS1250AB-100 512K X 8 NON-VOLATILE SRAM MODULE, 100 ns, DIP32
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