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參數資料
| 型號： | DS1244WP-120 |
| 廠商： | DALLAS SEMICONDUCTOR |
| 元件分類： | Timer or RTC |
| 英文描述： | 0 TIMER(S), REAL TIME CLOCK, DMA34 |
| 封裝： | POWERCAP MODULE BOARD-34 |
| 文件頁數： | 7/19頁 |
| 文件大?。?/td> | 273K |
| 代理商： | DS1244WP-120 |
DS1244/DS1244P
15 of 19
AC TEST CONDITIONS
Output Load:
50 pF + 1TTL Gate
Input Pulse Levels:
0–3 volts
Timing Measurement Reference Levels
Input:
1.5 volts
Output:
1.5 volts
Input Pulse Rise and Fall Times:
5 ns
NOTES:
1. WE is high for a read cycle.
2. OE = VIH or VIL . If OE = VIH during write cycle, the output buffers remain in a high impedance state.
3. tWP is specified as the logical AND of CE and WE. tWP is measured from the latter of CE or WE going
low to the earlier of CE or WE going high.
4. tDH , t DS are measured from the earlier of CE or WE going high.
5. These parameters are sampled with a 50 pF load and are not 100% tested.
6. If the CE low transition occurs simultaneously with or later than the WE low transition in Write Cycle
1, the output buffers remain in a high impedance state during this period.
7. If the CE high transition occurs prior to or simultaneously with the WE high transition, the output
buffers remain in a high impedance state during this period.
8. If WE is low or the WE low transition occurs prior to or simultaneously with the CE low transition, the
output buffers remain in a high impedance state during this period.
9. The expected tDR is defined as cumulative time in the absence of VCC with the clock oscillator running.
10. tWR is a function of the latter occurring edge of WE or CE.
11. Voltage are referencd to ground.
12. RST (Pin1) has an internal pull–up resistor.
13. Real–Time Clock Modules can be successfully processed through conventional wave–soldering
techniques as long as temperature exposure to the lithium energy source contained within does not
exceed +85°C. Post solder cleaning with water washing techniques is acceptable, provided that
ultrasonic vibration is not used.
In addition, for the PowerCap:
a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through solder
reflow oriented with the label side up (“l(fā)ive – bug”).
b. Hand Soldering and touch–up: Do not touch or apply the soldering iron to leads for more than 3 (three)
seconds.
To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove the part, apply
flux, heatthe lead frame pad until the solder reflow and use a solder wick to remove solder.
相關PDF資料 |
PDF描述 |
|---|---|
| DS1244Y-70 | 0 TIMER(S), REAL TIME CLOCK, PDMA28 |
| DS1244Y | 0 TIMER(S), REAL TIME CLOCK, PDIP28 |
| DS1245AB-100 | 128K X 8 NON-VOLATILE SRAM MODULE, 100 ns, DMA32 |
| DS1245Y-120 | 128K X 8 NON-VOLATILE SRAM MODULE, 120 ns, DMA32 |
| DS1245AB-85 | 128K X 8 NON-VOLATILE SRAM MODULE, 85 ns, DMA32 |
相關代理商/技術參數 |
參數描述 |
|---|---|
| DS1244WP-120+ | 功能描述:實時時鐘 256k NV SRAM w/Phantom Clock RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時間格式:HH:MM:SS RTC 存儲容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| DS1244WP-120IND | 功能描述:IC NVSRAM 256KBIT 120NS 34PCM RoHS:否 類別:集成電路 (IC) >> 時鐘/計時 - 實時時鐘 系列:- 產品培訓模塊:Obsolescence Mitigation Program 標準包裝:1 系列:- 類型:時鐘/日歷 特點:警報器，閏年，SRAM 存儲容量:- 時間格式:HH:MM:SS（12/24 小時） 數據格式:YY-MM-DD-dd 接口:SPI 電源電壓:2 V ~ 5.5 V 電壓 - 電源，電池:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-WDFN 裸露焊盤 供應商設備封裝:8-TDFN EP 包裝:管件 |
| DS1244WP-120IND+ | 功能描述:實時時鐘 256k NV SRAM w/Phantom Clock RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時間格式:HH:MM:SS RTC 存儲容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| DS1244Y | 制造商:Maxim Integrated Products 功能描述: 制造商:Maxim Integrated Products 功能描述:Real Time Clock, Non-Volatile, 28 Pin, Plastic, DIP |
| DS1244Y120 | 制造商:Maxim Integrated Products 功能描述: |
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