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參數(shù)資料
| 型號(hào)： | DG3409DB-T2-E1 |
| 廠商： | Vishay Siliconix |
| 文件頁數(shù)： | 8/15頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MUX LV 8CH DUAL 4CH 16MICRO |
| 標(biāo)準(zhǔn)包裝： | 3,000 |
| 功能： | 多路復(fù)用器 |
| 電路： | 2 x 4:1 |
| 導(dǎo)通狀態(tài)電阻： | 7 歐姆 |
| 電壓電源： | 單/雙電源 |
| 電壓 - 電源，單路/雙路(±)： | 2.7 V ~ 12 V，± 3 V ~ 6 V |
| 電流 - 電源： | 1µA |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-WFBGA |
| 供應(yīng)商設(shè)備封裝： | 16-Micro Foot? |
| 包裝： | 帶卷 (TR) |
www.vishay.com
2
Document Number: 72858
S11-0303-Rev. E, 28-Feb-11
Vishay Siliconix
DG3408, DG3409
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Product is End of Life
X = Do not care
For low and high voltage levels for VAX and VEN consult “Digital Control” Parameters for Specific V+ operation. See Specifications
Tables for:
Single Supply 12 V
Dual Supply V+ = 5 V, V- = - 5 V
Single Supply 5 V
Single Supply 3 V
Notes:
a. Signals on SX, DX or INX exceeding V+ or V- will be clamped by internal diodes. Limit forward diode current to maximum current ratings.
b. Refer to IPC/JEDEC (J-STD-020).
c. All bumps soldered or welded to PC board.
d. Derate 9 mW/°C above 70 °C.
TRUTH TABLE (DG3408)
A2
A1
A0
EN
On Switch
X
1
None
00
0
1
00
1
0
2
01
0
3
01
1
0
4
10
0
5
10
1
0
6
11
0
7
11
1
0
8
TRUTH TABLE (DG3409)
A1
A0
EN
On Switch
X
1
None
00
0
1
01
0
2
10
0
3
11
0
4
ORDERING INFORMATION (DG3408)
Temperature
Range
Package
Part Number
- 40 °C to 85 °C
MICRO FOOT: 16-Bump
(4 x 4, 0.5 mm Pitch,
238 m Bump Height)
DG3408DB-T2-E1
(Lead (Pb)-free)
ORDERING INFORMATION (DG3409)
Temperature
Range
Package
Part Number
- 40 °C to 85 °C
MICRO FOOT: 16-Bump
(4 x 4, 0.5 mm Pitch,
238 m Bump Height)
DG3409DB-T2-E1
(Lead (Pb)-free)
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
Parameter
Limit
Unit
Voltage Referenced V+ to V-
14
V
GND
7
Digital Inputsa, VS, VD
(V-) - 0.3 V to (V) + 0.3 V
Current (Any Terminal Except S or D)
30
mA
Continuous Current, S or D)
100
Peak Current, S or D (Pulsed at 1 ms, 10 % duty cycle max).
200
Package Solder Reflow Conditionsb
IR/Convection
250
°C
Storage Temperature
- 65 to 150
Power Dissipation (Package)c, (TA = 70 °C)
16-Bump (4 x 4 mm) MICRO FOOTd
719
mW
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