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參數(shù)資料
| 型號： | DC777A |
| 廠商： | Linear Technology |
| 文件頁數(shù)： | 7/16頁 |
| 文件大小： | 0K |
| 描述： | BOARD DAC LTC2601 |
| 軟件下載： | QuikEval System |
| 設計資源： | DC777A Design File DC777A Schematic |
| 標準包裝： | 1 |
| 系列： | QuikEval™ |
| DAC 的數(shù)量： | 1 |
| 位數(shù)： | 16 |
| 數(shù)據(jù)接口： | MICROWIRE?，串行，SPI? |
| 設置時間： | 10µs |
| DAC 型： | 電壓 |
| 工作溫度： | 0°C ~ 70°C |
| 已供物品： | 板 |
| 已用 IC / 零件： | LTC2601 |
| 相關產品： | LTC2601CDD-1#TRPBF-ND - IC DAC 16BIT SGL R-R VOUT 10DFN LTC2601IDD-1#TRPBF-ND - IC DAC 16BIT SGL R-R VOUT 10DFN LTC2601IDD-1#PBF-ND - IC DAC 16BIT R-R 10-DFN LTC2601CDD-1#PBF-ND - IC DAC 16BIT R-R 10-DFN LTC2601IDD#PBF-ND - IC DAC 16BIT SGL R-R VOUT 10DFN LTC2601CDD#PBF-ND - IC DAC 16BIT SGL R-R VOUT 10DFN LTC2601CDD#TRPBF-ND - IC DAC 16BIT SGL R-R VOUT 10DFN LTC2601IDD#TRPBF-ND - IC DAC 16BIT SGL R-R VOUT 10DFN LTC2601IDD-ND - IC DAC 16BIT SGL R-R VOUT 10DFN LTC2601CDD-ND - IC DAC 16BIT SGL R-R VOUT 10DFN 更多... |
LTC2601/LTC2611/LTC2621
15
2601fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3.00
±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.38
± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65
± 0.10
(2 SIDES)
0.75
±0.05
R = 0.115
TYP
2.38
±0.10
(2 SIDES)
1
5
10
6
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DD10) DFN 1103
0.25
± 0.05
2.38
±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65
±0.05
(2 SIDES)
2.15
±0.05
0.50
BSC
0.675
±0.05
3.50
±0.05
PACKAGE
OUTLINE
0.25
± 0.05
0.50 BSC
PACKAGE DESCRIPTION
Figure 3. Effects of Rail-to-Rail Operation On the DAC Transfer Curve. (a) Overall Transfer Function (b) Effect
of Negative Offset for Codes Near Zero Scale (c) Effect of Positive Full-Scale Error for Codes Near Full Scale
2601 F03
INPUT CODE
(b)
OUTPUT
VOLTAGE
NEGATIVE
OFFSET
0V
32, 768
0
65, 535
INPUT CODE
OUTPUT
VOLTAGE
(a)
VREF = VCC
(c)
INPUT CODE
OUTPUT
VOLTAGE
POSITIVE
FSE
OPERATION
DD Package
10-Lead Plastic DFN (3mm
× 3mm)
(Reference LTC DWG # 05-08-1699)
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