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參數(shù)資料
| 型號(hào)： | DC745A |
| 廠商： | Linear Technology |
| 文件頁數(shù)： | 20/28頁 |
| 文件大?。?/td> | 0K |
| 描述： | BOARD DELTA SIGMA ADC LTC2433-1 |
| 軟件下載： | QuikEval System |
| 設(shè)計(jì)資源： | DC745A Design File DC745A Schematic |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | QuikEval™ |
| ADC 的數(shù)量： | 2 |
| 位數(shù)： | 16 |
| 采樣率（每秒）： | 6.8 |
| 數(shù)據(jù)接口： | MICROWIRE?，串行，SPI? |
| 工作溫度： | 0°C ~ 70°C |
| 已用 IC / 零件： | LTC2433-1 |
| 已供物品： | 板 |
| 相關(guān)產(chǎn)品： | LTC2433-1IMS#PBF-ND - IC ADC DIFF 16BIT 3WIRE 10-MSOP LTC2433-1CMS#TRPBF-ND - IC ADC DIFF 16BIT 3WIRE 10-MSOP LTC2433-1IMS#TRPBF-ND - IC ADC DIFF 16BIT 3WIRE 10-MSOP LTC2433-1CMS#PBF-ND - IC ADC DIFF 16BIT 3WIRE 10-MSOP LTC2433-1IMS#TR-ND - IC CONV A/D 16BIT DIFF 10-MSOP LTC2433-1CMS#TR-ND - IC CONV A/D 16BIT DIFF 10-MSOP LTC2433-1IMS-ND - IC CONV A/D 16BIT DIFF 10-MSOP LTC2433-1CMS-ND - IC ADC DIFF 16BIT 3WIRE 10-MSOP |
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LTC2433-1
27
24331fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
U
PACKAGE DESCRIPTIO
MSOP (MS) 0802
0.53
± 0.01
(.021
± .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 – 0.27
(.007 – .011)
TYP
0.13
± 0.076
(.005
± .003)
0.86
(.034)
REF
0.50
(.0197)
BSC
12 3 45
4.90
± 0.15
(1.93
± .006)
0.497
± 0.076
(.0196
± .003)
REF
8
9
10
7 6
3.00
± 0.102
(.118
± .004)
(NOTE 3)
3.00
± 0.102
(.118
± .004)
NOTE 4
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0
° – 6° TYP
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.2 – 3.45
(.126 – .136)
0.889
± 0.127
(.035
± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.305
± 0.038
(.0120
± .0015)
TYP
0.50
(.0197)
BSC
MS Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661)
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