參數(shù)資料
型號(hào)： DAC8143FSZ-REEL
廠商： Analog Devices Inc
文件頁(yè)數(shù)： 7/12頁(yè)
文件大?。?/td> 0K
描述： IC DAC 12BIT DAISYCHAIN 16SOIC
產(chǎn)品培訓(xùn)模塊： Data Converter Fundamentals
DAC Architectures
標(biāo)準(zhǔn)包裝： 1,000
設(shè)置時(shí)間： 380ns
位數(shù)： 12
數(shù)據(jù)接口： 串行
轉(zhuǎn)換器數(shù)目： 1
電壓電源： 單電源
功率耗散（最大）： 500µW
工作溫度： -40°C ~ 85°C
安裝類(lèi)型： 表面貼裝
封裝/外殼： 16-SOIC（0.295"，7.50mm 寬）
供應(yīng)商設(shè)備封裝： 16-SOIC W
包裝： 帶卷 (TR)
輸出數(shù)目和類(lèi)型： 2 電流，單極；2 電流，雙極
采樣率（每秒）： 2.63M
DAC8143
–4–
REV. C
PIN CONNECTIONS
16-Lead Epoxy Plastic DIP
16-Lead SOIC
TOP VIEW
(Not to Scale)
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
IOUT1
RFB
DAC8143
IOUT2
VREF
AGND
VDD
STB1
CLR
LD1
DGND
SRO
STB4
SRI
STB3
STB2
LD2
ABSOLUTE MAXIMUM RATINGS
(TA = +25
°C, unless otherwise noted.)
VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +17 V
VREF to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 25 V
VRFB to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±25 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . VDD + 0.3 V
DGND to AGND . . . . . . . . . . . . . . . . . . . . . . . . VDD + 0.3 V
Digital Input Voltage Range . . . . . . . . . . . . . . . –0.3 V to VDD
Output Voltage (Pin 1, Pin 2) . . . . . . . . . . . . . . –0.3 V to VDD
Operating Temperature Range
FP/FS Versions . . . . . . . . . . . . . . . . . . . . . –40
°C to +85°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150
°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65
°C to +150°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300
°C
Package Type
JA*
JC
Units
16-Lead Plastic DIP
76
33
°C/W
16-Lead SOIC
92
27
°C/W
*
θ
JA is specified for worst case mounting conditions, i.e.,
θ
JA is specified for
device in socket for P-DIP package;
θ
JA is specified for device soldered to
printed circuit board for SOIC package.
CAUTION
1. Do not apply voltage higher than VDD or less than DGND po-
tential on any terminal except VREF (Pin 15) and RFB (Pin 16).
2. The digital control inputs are Zener-protected; however,
permanent damage may occur on unprotected units from
high energy electrostatic fields. Keep units in conductive
foam at all times until ready to use.
3. Use proper antistatic handling procedures.
4. Absolute Maximum Ratings apply to packaged devices.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device.
ORDERING GUIDE
Gain
Temperature
Package
Model
Nonlinearity
Error
Range
Descriptions
Options
DAC8143FP
±1 LSB
±2 LSB
–40
°C to +85°C
16-Lead Plastic DIP
N-16
DAC8143FS
±1 LSB
±2 LSB
–40
°C to +85°C
16-Lead SOIC
R-16W
Die Size: 99
× 107 mil, 10,543 sq. mils.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the DAC8143 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
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