參數(shù)資料
型號(hào)： DAC312HSZ-REEL
廠商： Analog Devices Inc
文件頁(yè)數(shù)： 10/14頁(yè)
文件大小： 0K
描述： IC DAC 12BIT MULT HS 20SOIC
產(chǎn)品培訓(xùn)模塊： Data Converter Fundamentals
DAC Architectures
標(biāo)準(zhǔn)包裝： 1,000
設(shè)置時(shí)間： 250ns
位數(shù)： 12
數(shù)據(jù)接口： 并聯(lián)
轉(zhuǎn)換器數(shù)目： 1
電壓電源： 雙 ±
功率耗散（最大）： 375mW
工作溫度： -40°C ~ 85°C
安裝類(lèi)型： 表面貼裝
封裝/外殼： 20-SOIC（0.295"，7.50mm 寬）
供應(yīng)商設(shè)備封裝： 20-SOIC W
包裝： 帶卷 (TR)
輸出數(shù)目和類(lèi)型： 2 電流，單極；2 電流，雙極
采樣率（每秒）： *
DAC312
–5–
REV. C
ORDERING GUIDE
1
Temperature
Package
Model
DNL
Range
Description
Option
DAC312ER
2
± 1/2 LSB 0°C to +70°C
Cerdip-20
Q-20
DAC312FR
± 1 LSB
–40
°C to +85°C
Cerdip-20
Q-20
DAC312BR/883
± 1 LSB
–55
°C to +125°C Cerdip-20
Q-20
DAC312HP
± 1 LSB
–40
°C to +85°C
Plastic DIP-20 N-20
DAC312HS
± 1 LSB
–40
°C to +85°C
SOL-20
R-20
NOTES
1Burn-in is available on commercial and industrial temperature range parts in
cerdip, plastic DIP, and TO-can packages.
2For devices processed in total compliance to MIL-STD-883, add/883 after part
number. Consult factory for 883 data sheet.
ABSOLUTE MAXIMUM RATINGS
1
Operating Temperature
DAC312E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0
°C to +70°C
DAC312F, DAC312H . . . . . . . . . . . . . . . . . . –40
°C to +85°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . –65
°C to +150°C
Storage Temperature (Tj) . . . . . . . . . . . . . . . . . –65
°C to +125°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . . . . . 300
°C
Power Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±18 V
Logic Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –5 V to +18 V
Analog Current Outputs . . . . . . . . . . . . . . . . . . . . –8 V to +12 V
Reference Inputs V14, V15 . . . . . . . . . . . . . . . . . . . . . . . V– to V+
Reference Input Differential Voltage (V14, V15) . . . . . . . . . . ± 18 V
Reference Input Current (I14) . . . . . . . . . . . . . . . . . . . . . 1.25 mA
Package Type
JA
2
JC
Units
20-Pin Hermetic DIP (R)
76
11
°C/W
20-Pin Plastic DIP (P)
69
27
°C/W
20-Pin SOL (S)
88
25
°C/W
NOTES
1Absolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.
2
θ
JA is specified for worst case mounting conditions, i.e., θJA is specified for device
in socket for cerdip and P-DIP packages;
θ
JA is specified for device soldered to
printed circuit board for SOL package.
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the DAC312 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
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