參數(shù)資料
型號(hào)： DAC1205D750HW
廠商： NXP Semiconductors N.V.
元件分類： 外設(shè)及接口
英文描述： Dual 12-bit DAC, up to 750 Msps; 2x 4x and 8x interpolating
封裝： DAC1205D750HW/C1<SOT638-1 (HTQFP100)|<<http://www.nxp.com/packages/SOT638-1.html<1<Always Pb-free,;DAC1205D750HW/C1<SOT638-1 (HTQFP100)|<<http://www.nxp.com/packages/SOT6
文件頁(yè)數(shù)： 37/42頁(yè)
文件大?。?/td> 352K
代理商： DAC1205D750HW
DAC1205D750
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 7 June 2011
37 of 42
NXP Semiconductors
DAC1205D750
Dual 12-bit DAC, up to 750 Msps; 4x and 8x interpolating
11. Package outline
Fig 20. Package outline SOT638-1 (HTQFP100)
UNIT
A
max.
A1
A2
A3
bp
HD
HE
Lp
ZD
(1)
ZE
(1)
c
e
L
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
1.2
0.15
0.05
1.05
0.95
0.25
0.27
0.17
0.20
0.09
14.1
13.9
0.5
16.15
15.85
1.15
0.85
7
°
0
°
0.08
0.08
0.2
1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT638-1
MS-026
03-04-07
05-02-02
D
(1)
E
(1)
14.1
13.9
16.15
15.85
Dh
Eh
7.1
6.1
7.1
6.1
1.15
0.85
bp
bp
e
θ
E
A1
A
Lp
L
detail X
(A3)
B
25
HD
HE
A2
v
M
B
D
ZD
A
c
ZE
e
v
M
A
X
1
100
76
75
51
50
26
y
pin 1 index
w
M
w
M
0
10 mm
scale
HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads;
body 14 x 14 x 1 mm; exposed die pad
SOT638-1
Dh
Eh
exposed die pad side
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