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參數(shù)資料
| 型號(hào)： | CX77315 |
| 英文描述： | CX77315 Product Summary|PA Modules for GSM/GPRS Handsets |
| 中文描述： | CX77315產(chǎn)品概要|功率放大器模塊的GSM / GPRS手機(jī) |
| 文件頁數(shù)： | 7/14頁 |
| 文件大小： | 517K |
| 代理商： | CX77315 |
PA Module for Dual-band EGSM900 DCS1800 / GPRS
Data Sheet CX77301
100956E
Skyworks Solutions, Inc. Proprietary Information
[781] 376-7000 FAX [781] 376-3100 SALES@SKYWORKSINC.COM
WWW.SKYWORKSINC.COM
7
SEPTEMBER 19, 2003
PACKAGE DIMENSIONS AND PIN DESCRIPTIONS
Figure 3
displays the dimensions of the 16-pin leadless CX77301
dual-band PAM.
Figure 4
provides a recommended phone board
layout footprint for the PAM to help the designer attain optimum
thermal conductivity, good grounding, and minimum RF
discontinuity for the 50 ohm terminals.
Figure 5
shows the device
pin configuration, and
Table 4
describes the pin names and
signals.
BOTTOM VIEW
SIDE VIEW
TOP VIEW
SOLDER MASK EDGES
0.1 A B C
2X R0.3
2X R0.2
1.145
0.145
0.9
0.76
0.96
METAL PAD EDGES
0.05 A B C
DETAIL
A
SCPAD
3X THIS ROTATION
5X ROTATED 90 CW
4X R0.2
SOLDER MASK OPENING
0.15 A B C
(3.33)
METAL PAD - PIN 1
( / 0.15)
SOLDER MASK OPENING
( / 0.30)
(4.43)
4X 1.905
2X 3.514
2X 2.261
4X 1.905
4X 3.81
(0.465)
A
MCM SUBSTRATE
MOLD
A
A
0.025
1.5±0.1
0.08
0.10 A B C
9.14
C
B
11.64
PIN 1 INDICATOR
NOTES: unless otherwise specified
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING IN ACCORDANCE WITH ASME Y14.5M
–
1994
3. SEE APPLICABLE BONDING DIAGRAM AND DEVICE ASSEMBLY DRAWING FOR DIE AND COMPONENT PLACEMENT.
4. PADS ARE METAL DEFINED. THE CENTER PAD IS SOLDER MASK DEFINED.
100956_004
Figure
. CX77301 Package Dimensions
16
pin Module (All Vi
ews)
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