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參數(shù)資料
| 型號： | CS5253B-1GDPR5 |
| 英文描述： | Positive Adjustable Voltage Regulator |
| 中文描述： | 積極可調(diào)電壓穩(wěn)壓器 |
| 文件頁數(shù)： | 10/12頁 |
| 文件大?。?/td> | 93K |
| 代理商： | CS5253B-1GDPR5 |
CS5253B–1
http://onsemi.com
10
Calculating Power Dissipation and
Heat Sink Requirements
High power regulators such as the CS5253B–1 usually
operate at high junction temperatures. Therefore, it is
important to calculate the power dissipation and junction
temperatures accurately to ensure that an adequate heat sink
is used. Since the package tab is connected to V
OUT
on the
CS5253B–1, electrical isolation may be required for some
applications. Also, as with all high power packages, thermal
compound in necessary to ensure proper heat flow. For
added safety, this high current LDO includes an internal
thermal shutdown circuit
The thermal characteristics of an IC depend on the
following four factors: junction temperature, ambient
temperature, die power dissipation, and the thermal
resistance from the die junction to ambient air. The
maximum junction temperature can be determined by:
TJ(max)
TA(max)
PD(max)
R JA
The maximum ambient temperature and the power
dissipation are determined by the design while the
maximum junction temperature and the thermal resistance
depend on the manufacturer and the package type. The
maximum power dissipation for a regulator is:
PD(max)
(VIN(max)
VIN(max)
VOUT(min))IOUT(max)
IIN(max)
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air. Each material in the heat flow path
between the IC and the outside environment has a thermal
resistance which is measured in degrees per watt. Like series
electrical resistances, these thermal resistances are summed
to determine the total thermal resistance between the die
junction and the surrounding air, R
Θ
JA
. This total thermal
resistance is comprised of three components. These resistive
terms are measured from junction to case (R
Θ
JC
), case to
heat sink (R
Θ
CS
), and heat sink to ambient air (R
Θ
SA
). The
equation is:
R JA
R JC
R CS
R SA
The value for R
QJC
is 2.5
°
C/watt for the CS5253B–1 in
the D
2
PAK package. For a high current regulator such as the
CS5253B–1 the majority of heat is generated in the power
transistor section. The value for R
Θ
SA
depends on the heat
sink type, while the R
Θ
CS
depends on factors such as
package type, heat sink interface (is an insulator and thermal
grease used), and the contact area between the heat sink and
the package. Once these calculations are complete, the
maximum permissible value of R
Θ
JA
can be calculated and
the proper heat sink selected. For further discussion on heat
sink selection, see our application note “Thermal
Management for Linear Regulators,” document number
SR006AN/D, available through the Literature Distribution
Center or via our website at http://www.onsemi.com.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CS5253B-1GDPR5G | 制造商:ON Semiconductor 功能描述: |
| CS5253B-8 | 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:3.0 A LDO 5-Pin 2.5 V Fixed Linear Regulator for Remote Sense Applications |
| CS5253B-8/D | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:3A LDO 5-Pin 2.5V Fixed Linear Regulatorfor Remote Sense Applications |
| CS5253B-8_05 | 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:3.0 A LDO 5−Pin 2.5 V Fixed Linear Regulator for Remote Sense Applications |
| CS5253B-8GDP5 | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:ON Semiconductor 功能描述:3.0 A LDO 5-Pin 2.5 V Fixed Linear Regulator for Remote Sense Applications |
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