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參數(shù)資料
| 型號： | CS5233-3GDF8 |
| 元件分類： | 基準(zhǔn)電壓源/電流源 |
| 英文描述： | THREE-TERMINAL POSITIVE FIXED VOLTAGE REGULATORS |
| 中文描述： | 三端固定電壓調(diào)節(jié)器 |
| 文件頁數(shù)： | 9/12頁 |
| 文件大?。?/td> | 95K |
| 代理商： | CS5233-3GDF8 |
CS5233–3
http://onsemi.com
9
Thermal characteristics of an IC depend on four
parameters: ambient temperature (T
A
in
°
C), power
dissipation (P
D
in watts), thermal resistance from the die to
the ambient air (
θ
JA
in
°
C per watt) and junction temperature
(T
J
in
°
C). The maximum junction temperature is calculated
from the formula below:
TJ(MAX)
TA(MAX)
JA
PD(MAX)
Maximum ambient temperature and power dissipation are
determined by the design, while
θ
JA
is dependent on the
package manufacturer. The maximum junction temperature
for operation of the CS5233–3 within specification is
150
°
C. The maximum power dissipation of a linear
regulator is given as
PD(MAX)
(VIN(MAX)
ILOAD(MAX)
IGND(MAX)
VOUT(MIN))
VIN(MAX)
where I
GND(MAX)
is the IC bias current.
It is possible to change the effective value of
θ
JA
by adding
a heatsink to the design. A heatsink serves in some manner
to raise the effective area of the package, thus improving the
flow of heat from the package into the surrounding air. Each
material in the path of heat flow has its own characteristic
thermal resistance, all measured in
°
C per watt. The thermal
resistances are summed to determine the total thermal
resistance between the die junction and air. There are three
components of interest: junction–to–case thermal resistance
(
θ
JC
), case–to–heatsink thermal resistance (
θ
CS
) and
heatsink–to–air thermal resistance (
θ
SA
). The resulting
equation for junction–to–air thermal resistance is
JA
JA
JC
JC
CS
SAfor
SA, or
CS
0
The value of
θ
JC
for the CS5233–3 is provided in the
Packaging Information section of this data sheet.
θ
CS
can be
considered zero, since heat is conducted out of the package
by the IC leads and the tab of the D
2
PAK package, and since
the IC leads and tab are soldered directly to the PC board.
Modification of
θ
SA
is the primary means of thermal
management. For surface mount components, this means
modifying the amount of trace metal that connects to the IC.
The thermal capacity of PC board traces is dependent on
how much copper area is used, if the IC is in direct contact
with the metal, whether the metal surface is coated with
some type of sealant, and whether there is airflow across the
PC board. The chart provided below shows heatsinking
capability of a square, single sided copper PC board trace.
The area is given in square millimeters, and it is assumed
there is no airflow across the PC board.
Figure 12. Thermal Resistance Capability of
Copper PC Board Metal Traces
PC Board Trace Area (mm
2
)
70
0
T
°
C
2000
50
60
40
30
20
10
0
4000
6000
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| CS5233-3GDFR8 | THREE-TERMINAL POSITIVE FIXED VOLTAGE REGULATORS |
| CS5233-3GDP5 | THREE-TERMINAL POSITIVE FIXED VOLTAGE REGULATORS |
| CS5233-3GDPR5 | THREE-TERMINAL POSITIVE FIXED VOLTAGE REGULATORS |
| CS5317-TD | Analog-to-Digital Converter， 16-Bit |
| CS5317-BD | Analog-to-Digital Converter， 16-Bit |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CS5233-3GDFR8 | 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:500 mA and 1.5 A, 3.3 V Dual Input Linear Regulator with Auxiliary Control |
| CS5233-3GDP5 | 制造商:ON Semiconductor 功能描述:500 mA and 1.5 A, 3.3 V Dual Input Linear Regulator with Auxiliary Control |
| CS5233-3GDPR5 | 功能描述:IC REG LDO 3.3V 1.5A D2PAK-5 RoHS:否 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - 線性 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 穩(wěn)壓器拓?fù)浣Y(jié)構(gòu):正，固定式和可調(diào)式 輸出電壓:3.3V，1.25 V ~ 5.7 V 輸入電壓:4.5 V ~ 7 V 電壓 - 壓降（標(biāo)準(zhǔn)）:1.1V @ 1A 穩(wěn)壓器數(shù)量:2 電流 - 輸出:1A 電流 - 限制（最小）:1A 工作溫度:0°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:TO-252-5，DPak（4 引線 + 接片），TO-252AD 供應(yīng)商設(shè)備封裝:PPAK 包裝:管件 其它名稱:497-3576-5 |
| CS5234-000 | 制造商:TE Connectivity 功能描述:EPD-RWC-21838 - Cable Rools/Shrink Tubing |
| CS5236-000 | 制造商:TE Connectivity 功能描述:EPD-RWC-21836 - Cable Rools/Shrink Tubing |
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