參數(shù)資料
型號(hào): CPC7582BC
廠商: CLARE INC
元件分類: 通信及網(wǎng)絡(luò)
中文描述: SPECIALTY TELECOM CIRCUIT, PDSO16
封裝: ROHS COMPLIANT, SOIC-16
文件頁(yè)數(shù): 10/19頁(yè)
文件大小: 566K
代理商: CPC7582BC
CPC7582
18
www.clare.com
R05
3.2 Printed-Circuit Board Land Patterns
3.2.1 16-Pin SOIC
3.2.2 16-Pin DFN
NOTE: Because the metallic pad on the bottom of the
DFN package is connected to the substrate of the die,
Clare recommends that no printed circuit board traces
or vias be placed under this area to maintain minimum
creepage and clearance values.
3.3 Tape and Reel Packaging
3.3.1 16-Pin SOIC
2.00
(0.079)
1.27
(0.050)
mm
(inches)
DIMENSIONS
9.40
(0.370)
0.60
(0.024)
DIMENSIONS
mm
(inches)
5.80
(0.228)
0.35
(0.014)
1.05
(0.041)
0.80
(0.031)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
Tape and Reel Packaging for 16-Pin SOIC Package
Dimensions
mm
(inches)
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
User Direction of Feed
Top Cover
Tape
P=12.00
(0.47)
A
0=10.90 + 0.15
(0.429 + 0.010)
B
0=10.70 + 0.15
(0.421 + 0.01)
W=16.00 + 0.30
(0.630 + 0.010)
K
0=3.20 + 0.15
(0.193 + 0.01)
K
1=2.70 + 0.15
(0.106 + 0.01)
Pin 1
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