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10
Recommended Output Buffering Circuits
In many systems, DSP and other forms of processing will
employ TTL or CMOS circuitry. The output logic levels of
the CLC935 data converter will need to be translated
to match those of the processing circuitry. Several
options and translators exist to perform this task. Special
care must be used if “10125” type circuits are used
since these devices are not particularly suited to a high-
resolution, low-noise, analog environment. Other options
include TI’s 105574 Latched Translator.
ECL to TTL/CMOS Level Translator Options
Power Supplies, Grounding, and Bypassing
To obtain the best possible performance from any high-
speed device, the design engineer must pay close
attention to power supplies, grounding and bypassing.
This applies not only to the A/D data converter itself but
throughout the system as well.
The recommended supply decoupling scheme is as
follows: One 0.01
μ
F to 0.033
μ
F chip capacitor at every
supply pin, with a +6.8
μ
F to +10
μ
F tantalum for each of
the four main supply feeds (within a few inches of the
ADC). Note that supply feeds with excessive digital
switching noise may require separate filtering using
ferrite beads, additional capacitance, or split supplies.
Proper bypassing of all other integrated circuits,
especially logic circuits, should minimize power supply
and ground transients.
All of the CLC935 data converter grounds are internally
connected. A single low-impedance ground plane is
recommended. Split analog and digital grounds are not
recommended. The SIGNAL GND is used internally for
the track-and-hold and buffering amplifiers, while the
other GROUND pins are essentially power supply
returns.
The SIGNAL GND pins (pins 39 & 40) are very sensitive
nodes, and should have a solid, low-impedance, ground
connection. The path that the input signal and its return
currents follow must be isolated from other circuitry.
Single-point grounding at the data converter should min-
imize common impedance paths which would allow other
signals to directly couple into the analog input, affecting
accuracy.
CLC935 Timing Diagram
Thermal Considerations
The following strategies can be applied to minimize junction
temperatures:
a) A thick copper ground plane ... an appreciable
amount of heat is conducted out of the A/D
through its leads.
b) A copper or aluminum stand-off between the
ground plane and the bottom of the data converter
package (thermal paste may be useful).
c) A CHO-THERM
pad between the ground plane
and the bottom of the data converter package.
To maximize heat conduction leave a patch of
exposed (no solder mask) ground plane under the
data converter.
d) Moving air over the A/D converter.
e) Heat sink attached to the converter available from
National Semiconductor.
DATA INV.
Optional DATA READY
clock generation circuit.
Do NOT use CONVERT
and CONVERT directly.
(MSB) D1
(MSB) D1
D6
D7
(LSB) D12
0.1
μ
F
0.1
μ
F
CLC935
50
50
10114
V
BB
100151
100151
*
*
*
*
*
*
**
**
**
ECL PROCESSING
CIRCUITRY
.
.
**
** Do NOT use terminations
* Use standard ECL terminations
.
.
.
.
.
.
*
**
**
**
**
(MSB) D1
(MSB) D1
D6
D7
(LSB) D12
DATA INV.
CLC935
***
***
***
***
***
SN10KHT5574
SN10KHT5574
TTL PROCESSING
CIRCUITRY
DATA
READY
DATA
READY
*** Follow mfg. recomendations
** Do NOT use terminations
* Use standard ECL terminations
Effective
Analog
Sample
N
SN + 1
N + 2
SN + 3
CONVERT
CONVERT
Data
N - 2
N - 3
N - 1
N - 2
N
CLC935
N - 1
N + 1
N
t
PWL
t
PWH
t
HLD
t
DIV
1
CR
Note: t
DIV
=
t
HLD
+ Data Bit Skew