參數(shù)資料
型號(hào): CGY2014ATW
廠商: NXP SEMICONDUCTORS
元件分類: 衰減器
英文描述: GSM/DCS/PCS power amplifier
中文描述: 880 MHz - 915 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER
封裝: PLASTIC, HTSSOP-20
文件頁數(shù): 5/12頁
文件大?。?/td> 73K
代理商: CGY2014ATW
2000 Nov 28
5
Philips Semiconductors
Preliminary specification
GSM/DCS/PCS power amplifier
CGY2014ATW
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Note
1.
The total power dissipation is measured under GSM pulse conditions in a good thermal environment;
see Application Note(tbf).
THERMAL CHARACTERISTICS
Note
1.
This thermal resistance is measured under GSM pulse conditions in a good thermal environment;
see Application Note(tbf).
DC CHARACTERISTICS
V
DD
= 3.5 V; T
amb
= 25
°
C; measured on the Philips application diagram (see Fig.3); general operating conditions
applied; peak current values measured during burst; unless otherwise specified.
Notes
1.
2.
3.
The supply circuit includes a (drain) MOS switch with R
DSon
= 40 m
. The battery voltage is 3.6 V (typical).
V
DD1(LB)
= 2.8 V; V
DD1(LB)
adjusted for P
o(LB)
= 15 dBm, this adjustment is typically 0.5V.
V
DD1(HB)
= 2.8 V; V
DD1(HB)
adjusted for P
o(HB)
= 15 dBm, this adjustment is typically 0.6V.
SYMBOL
PARAMETER
CONDITIONS
MAX.
UNIT
V
DD
T
j(max)
T
stg
P
tot
P
i(LB)
P
i(HB)
supply voltage
maximum operating junction temperature
storage temperature
total power dissipation
GSM input power
DCS/PCS input power
5.2
150
150
2.0
10
10
V
°
C
°
C
W
dBm
dBm
note 1
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th(j-c)
thermal resistance from junction to case
note 1
30
K/W
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies: pins V
DD1(LB)
, V
DD2(LB)
, RFO/V
DD3(LB)
, V
DD1(HB)
, V
DD2(HB)
and RFO/V
DD3(HB)
V
DD
I
DD(LB)
I
DD(HB)
I
DD(lp)(LB)
I
DD(lp)(HB)
supply voltage
GSM positive peak supply current
DCS/PCS positive peak supply current
GSM positive supply current
DCS/PCS positive supply current
note 1
P
i(LB)
= 5 dBm
P
i(HB)
= 5 dBm
note 2
note 3
0
3.5
2
1.5
200
200
5.2
300
300
V
A
A
mA
mA
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