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參數(shù)資料
| 型號(hào)： | CDB3318 |
| 廠商： | Cirrus Logic Inc |
| 文件頁數(shù)： | 13/17頁 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR CS3318 VOL CTRL |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 主要目的： | 音頻，音量控制 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | CS3318 |
| 主要屬性： | 8 個(gè)單端模擬輸入和輸出，USB 或 RS232 接口 |
| 次要屬性： | 圖形用戶界面 |
| 已供物品： | 板 |
| 產(chǎn)品目錄頁面： | 759 (CN2011-ZH PDF) |
| 相關(guān)產(chǎn)品： | CS3318-CQZR-ND - IC ANLG VOL CTRL 8CH 48-LQFP 598-1180-ND - IC ANLG VOL CTRL 8CH DGTL 48LQFP |
| 其它名稱： | 598-1497 |
5
Precision Edge
SY89827L
Micrel, Inc.
M9999-073010
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings(Note1)
Power Supply Voltage (VCCI, VCCO)...............–0.5 to +4.0V
Input Voltage (VIN)............................................–0.5 to VCCI
Output Current (IOUT) ............................................... –50mA
Lead Temperature (TLEAD, Soldering, 20sec.) .......... 260°C
Storage Temperature (TS) ............................ –65 to +150°C
ESD Rating,
Note 3 .................................................... >1kV
Operating Ratings(Note2)
Supply Voltage
(VCCI)..................................................... +3.3V to +3.47V
(VCCO) ..................................................... +1.6V to +2.0V
Ambient Temperature (TA).......................... –40°C to +85°C
Package Thermal Resistance
TQFP(θJA)
Exposed pad soldered to GND,
Note4
Still-Air (multi-layer PCB)......................................... 23°C/W
–200lfpm (multi-layer PCB)..................................... 18°C/W
–500lfpm (multi-layer PCB)..................................... 15°C/W
Exposed pad NOT soldered to GND (not recommended)
Still-Air (multi-layer PCB)......................................... 44°C/W
–200lfpm (multi-layer PCB)..................................... 36°C/W
–500lfpm (multi-layer PCB)..................................... 30°C/W
TQFP(θJC) .........................................................4.4°C/W
PowerSupply: TA = –40°C to +85°C
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCCI
VCC Core
3.13
3.3
3.47
V
VCCO
VCC Output
1.6
1.8
2.0
V
ICCI
ICC Core
No Load
140
170
mA
HSTLInput/Output: VCCI = 3.3V ±5%, VCCO = 1.8V ±10%, TA = –40°C to +85°C
Symbol
Parameter
Condition
Min
Typ
Max
Units
VOH
Output HIGH Voltage
Note 5
1.0
1.2
V
VOL
Output LOW Voltage
Note 5
0.2
0.4
V
VIH
Input HIGH Voltage
VX+0.1
1.6
V
VIL
Input LOW Voltage
–0.3
VX–0.1
V
VX
Input Crossover Voltage
0.68
0.9
V
IIH
Input HIGH Current
+20
–350
A
IIL
Input LOW Current
–500
A
Note 1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratlng conditions
for extended periods may affect device reliability.
Note 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
Note 3. Devices are ESD sensitive. Handling precautions recommended.
Note4. It is highly recommended to solder the exposed pad of the EPAD-TQFP package to a ground plane on the PCB for maximum thermal
efficiency.
Note 5. Outputsloadedwith50-to-ground.
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