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參數(shù)資料
| 型號(hào)： | CD40174BMS |
| 廠商： | Intersil Corporation |
| 英文描述： | CMOS Hex D Type Flip-Flop(CMOS 六 D觸發(fā)器) |
| 中文描述： | 的CMOS六角D型觸發(fā)器（六?的CMOS觸發(fā)器） |
| 文件頁(yè)數(shù)： | 8/8頁(yè) |
| 文件大?。?/td> | 70K |
| 代理商： | CD40174BMS |
7-1391
CD40174BMS
FIGURE 8. TYPICAL PROPAGATION DELAY TIME (CLOCK TO OUTPUT) AS A FUNCTION OF LOAD CAPACITANCE
Typical Performance Curves
(Continued)
AMBIENT TEMPERATURE (T
A
) = +25
o
C
SUPPLY VOLTAGE (VDD) = 5V
10V
15V
LOAD CAPACITANCE (CL) (pF)
P
0
10
20
30
40
50
60
70
80
90
100
0
25
50
75
100
125
150
175
200
Waveform
FIGURE 9. DEFINITION OF SETUP, HOLD, PROPAGATION
DELAY, AND REMOVAL TIMES
CLOCK
INPUT
DATA
INPUT
OUTPUT
VDD
CLEAR
0
90%
50%
10%
VDD
50%
50%
0
0
0
tr CL
tf CL
tH(HL)*
tH(LH)*
tSU(HL)*
tSU(LH)*
tTLH
tTHL
tPHL
tPLH
tREM
90%
50%
10%
VDD
VDD
*(LH) OR (HL) OPTIONAL
Pad Layout
DIMENSIONS AND PAD LAYOUT FOR CD40174BMSH
The photographs and dimensions of each CMOS chip represent a chip when
it is part of the wafer. When the wafer is separated into individual chips, the an-
gle of cleavage may vary with respect to the chip face for different chips. The
actual dimensions of the isolated chip, therefore, may differ slightly from the
nominal dimensions shown. The user should consider a tolerance of -3 mils to
+16 mils applicable to the nominal dimensions shown.
Dimension in parenthesis are in millimeters and are derived from the basic inch
dimensions as indicated. Grid graduations are in mils (10
inch).
METALLIZATION:
PASSIVATION:
BOND PADS:
DIE THICKNESS:
Thickness: 11k
14k
, AL.
10.4k - 15.6k
, Silane
0.004 inches X 0.004 inches MIN
0.0198 inches - 0.0218 inches
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| CD40174 | CMOS HEX D-TYPE FLIP-FLOP |
| CD40174BC | Hex,Quad D Flip-Flop |
| CD40174BCJ | Hex,Quad D Flip-Flop |
| CD40174BCN | Hex,Quad D Flip-Flop |
| CD40174BM | Hex,Quad D Flip-Flop |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CD40174BMT | 功能描述:觸發(fā)器 CMOS Hex D-Type Flip-Flop RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| CD40174BMTE4 | 功能描述:觸發(fā)器 CMOS Hex D-Type Flip-Flop RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| CD40174BMTG4 | 功能描述:觸發(fā)器 CMOS Hex D-Type Flip-Flop RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| CD40174BMW | 制造商:Texas Instruments 功能描述: |
| CD40174BMW/883 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Hex D-Type Flip-Flop |
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