- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄237424 > C9314-02 (ARIES ELECTRONICS INC) DIP14, IC SOCKET PDF資料下載
參數(shù)資料
| 型號： | C9314-02 |
| 廠商： | ARIES ELECTRONICS INC |
| 元件分類： | 插座 |
| 英文描述： | DIP14, IC SOCKET |
| 封裝： | ROHS COMPLIANT |
| 文件頁數(shù)： | 1/1頁 |
| 文件大?。?/td> | 453K |
| 代理商： | C9314-02 |
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 FAX (215) 781-9845
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
FEATURES
Anti-wicking design on LO-PROfile sockets eliminates flux or solder contamination
Dual beam, edge-grip contacts provide high retention and positive contact
End-to-end and side-to-side stackable
SPECIFICATIONS
Body: black UL-94V-0 glass-filled Nylon 4/6
Dual Beam Contact: Phosphor Bronze Alloy 521
Contact Plating: (overall) 50μ [1.27μ] Nickel per SAE-AMS-QQN-290); Tin 200μ
[5.08μ] min. matte Tin per ASTM B545-97; Tin/Lead 100-150μ [2.54-3.81μ]
min. 90/10 Tin/Lead per MIL-P-81728; Gold 10μ [0.25μ] min. Gold per MIL-
G-45204 in contact area and 100-150μ [2.54-3.81μ] min 90/10 Tin/Lead per
MIL-P-81728 on Solder Tail
Wafer: Nomex, 0.005 [0.13] thick
Contact Current Rating: 1 amp
Contact Resistance: 20 MOhms initial
Insulation Resistance: 100 MOhms @ 500VDC per MIL-STD-1344, Method
3003.1
Dielectric Withstanding Voltage: 1000VAC
Operating Temperature: -67°F to 221°F [-55°C to 105°C] Tin = -67°F to 257°F [-55°C to 125°C] Gold
Accepts Leads: up to 0.011 x 0.018 ±0.003 [0.28 x 0.46 ±0.08] or 0.021 [0.53] diameter, 0.070-0.135 [1.78-3.43] long
MOUNTING CONSIDERATIONS
Suggested PCB Hole Size: 0.036 ±0.002 [0.91 ±0.05] diameter
Rev. F
Series C84/93 LO-PROfile Dual Beam
Solder Tail Edge-Grip Sockets
NOTE: Aries specializes in custom design and production.
In addition to the standard products shown on this page,
special materials, platings, sizes, and configurations can
be furnished, depending on quantities. Aries reserves the
right to change product specifications without notice.
No. of Pins
Dim “A”
Dim. “B”
Centers “C”
Dim. “D”
Dim. “E”
Dim. “F”
6
0.290 [7.37]
0.200 [5.08]
0.300 [7.62]
0.395 [10.03]
—
8
0.390 [9.91]
0.300 [7.62]
0.395 [10.03]
—
14
0.690 [17.53]
0.600 [15.24]
0.300 [7.62]
0.395 [10.03]
—
0.350 [8.89]
16
0.790 [20.07]
0.700 [17.78]
0.300 [7.62]
0.395 [10.03]
—
0.400 [10.16]
18
0.890 [22.61]
0.800 [20.32]
0.300 [7.62]
0.395 [10.03]
—
0.450 [11.43]
20
0.990 [25.15]
0.900 [22.86]
0.300 [7.62]
0.395 [10.03]
—
0.500 [12.70]
24
1.190 [30.23]
1.100 [27.94]
0.600 [15.24]
0.695 [17.65]
0.400 [10.16]
—
28
1.390 [35.31]
1.300 [33.02]
0.600 [15.24]
0.695 [17.65]
0.500 [12.70]
—
40
1.990 [50.55]
1.900 [48.26]
0.600 [15.24]
0.695 [17.65]
0.500 [12.70]
1.000 [25.40]
ORDERING INFORMATION
C XX - XX XX - TL
Socket Series
Pin Plating
93 = Gold
84 = Tin
No. of Pins
(see Table)
Plating Option
Tin/Lead
02 = Nomex Wafer (std)
ALL DIMENSIONS: INCHES [MILLIMETERS]
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| C9316-02 | DIP16, IC SOCKET |
| C9316-03 | DIP16, IC SOCKET |
| C9318-03 | DIP18, IC SOCKET |
| C9320-02 | DIP20, IC SOCKET |
| C9328-02 | DIP28, IC SOCKET |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| C93-147224-61S | 制造商:Amphenol Corporation 功能描述:RECEPT |
| C9316-02 | 功能描述:IC 與器件插座 LO-PROFILE 16 PINS MYLAR WAFER GOLD RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點數(shù)量:2011 觸點電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| C93166-000 | 制造商:TE Connectivity 功能描述:HT-SCE-1-2.0-0-PB-CS7783 - Bulk |
| C93175-000 | 制造商:TE Connectivity 功能描述:Fuse Chip 2A Fast 2-Pin Solder Pad Surface Mount T/R 制造商:TE Connectivity 功能描述:0402SFF200F/24-2 - Tape and Reel 制造商:TE Connectivity 功能描述:FUSE 2.0A 24V FAST SMD 0402 制造商:TE Connectivity / Raychem 功能描述:FUSE 2.0A 24V FAST SMD 0402 制造商:TE CONNECTIVITY RAYCHEM-POLYSWITCH 功能描述:El Fuse / 0402SFF200F/24-2 |
| C9318-02 | 功能描述:IC 與器件插座 LO-PROFILE 18 PINS MYLAR WAFER GOLD RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點數(shù)量:2011 觸點電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。