參數(shù)資料
型號： C9316-02
廠商： ARIES ELECTRONICS INC
元件分類： 插座
英文描述： DIP16, IC SOCKET
封裝： ROHS COMPLIANT
文件頁數(shù)： 1/1頁
文件大?。?/td> 453K
代理商： C9316-02
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 FAX (215) 781-9845
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
FEATURES
Anti-wicking design on LO-PROfile sockets eliminates flux or solder contamination
Dual beam, edge-grip contacts provide high retention and positive contact
End-to-end and side-to-side stackable
SPECIFICATIONS
Body: black UL-94V-0 glass-filled Nylon 4/6
Dual Beam Contact: Phosphor Bronze Alloy 521
Contact Plating: (overall) 50μ [1.27μ] Nickel per SAE-AMS-QQN-290); Tin 200μ
[5.08μ] min. matte Tin per ASTM B545-97; Tin/Lead 100-150μ [2.54-3.81μ]
min. 90/10 Tin/Lead per MIL-P-81728; Gold 10μ [0.25μ] min. Gold per MIL-
G-45204 in contact area and 100-150μ [2.54-3.81μ] min 90/10 Tin/Lead per
MIL-P-81728 on Solder Tail
Wafer: Nomex, 0.005 [0.13] thick
Contact Current Rating: 1 amp
Contact Resistance: 20 MOhms initial
Insulation Resistance: 100 MOhms @ 500VDC per MIL-STD-1344, Method
3003.1
Dielectric Withstanding Voltage: 1000VAC
Operating Temperature: -67°F to 221°F [-55°C to 105°C] Tin = -67°F to 257°F [-55°C to 125°C] Gold
Accepts Leads: up to 0.011 x 0.018 ±0.003 [0.28 x 0.46 ±0.08] or 0.021 [0.53] diameter, 0.070-0.135 [1.78-3.43] long
MOUNTING CONSIDERATIONS
Suggested PCB Hole Size: 0.036 ±0.002 [0.91 ±0.05] diameter
12001
Rev. F
Series C84/93 LO-PROfile Dual Beam
Solder Tail Edge-Grip Sockets
NOTE: Aries specializes in custom design and production.
In addition to the standard products shown on this page,
special materials, platings, sizes, and configurations can
be furnished, depending on quantities. Aries reserves the
right to change product specifications without notice.
No. of Pins
Dim “A”
Dim. “B”
Centers “C”
Dim. “D”
Dim. “E”
Dim. “F”
6
0.290 [7.37]
0.200 [5.08]
0.300 [7.62]
0.395 [10.03]
—
8
0.390 [9.91]
0.300 [7.62]
0.395 [10.03]
—
14
0.690 [17.53]
0.600 [15.24]
0.300 [7.62]
0.395 [10.03]
—
0.350 [8.89]
16
0.790 [20.07]
0.700 [17.78]
0.300 [7.62]
0.395 [10.03]
—
0.400 [10.16]
18
0.890 [22.61]
0.800 [20.32]
0.300 [7.62]
0.395 [10.03]
—
0.450 [11.43]
20
0.990 [25.15]
0.900 [22.86]
0.300 [7.62]
0.395 [10.03]
—
0.500 [12.70]
24
1.190 [30.23]
1.100 [27.94]
0.600 [15.24]
0.695 [17.65]
0.400 [10.16]
—
28
1.390 [35.31]
1.300 [33.02]
0.600 [15.24]
0.695 [17.65]
0.500 [12.70]
—
40
1.990 [50.55]
1.900 [48.26]
0.600 [15.24]
0.695 [17.65]
0.500 [12.70]
1.000 [25.40]
ORDERING INFORMATION
C XX - XX XX - TL
Socket Series
Pin Plating
93 = Gold
84 = Tin
No. of Pins
(see Table)
Plating Option
Tin/Lead
02 = Nomex Wafer (std)
ALL DIMENSIONS: INCHES [MILLIMETERS]
相關(guān)PDF資料
PDF描述
C9316-03 DIP16, IC SOCKET
C9318-03 DIP18, IC SOCKET
C9320-02 DIP20, IC SOCKET
C9328-02 DIP28, IC SOCKET
CPC2-104-B-02-SG-CU SOP4, IC SOCKET
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
C93166-000 制造商:TE Connectivity 功能描述:HT-SCE-1-2.0-0-PB-CS7783 - Bulk
C93175-000 制造商:TE Connectivity 功能描述:Fuse Chip 2A Fast 2-Pin Solder Pad Surface Mount T/R 制造商:TE Connectivity 功能描述:0402SFF200F/24-2 - Tape and Reel 制造商:TE Connectivity 功能描述:FUSE 2.0A 24V FAST SMD 0402 制造商:TE Connectivity / Raychem 功能描述:FUSE 2.0A 24V FAST SMD 0402 制造商:TE CONNECTIVITY RAYCHEM-POLYSWITCH 功能描述:El Fuse / 0402SFF200F/24-2
C9318-02 功能描述:IC 與器件插座 LO-PROFILE 18 PINS MYLAR WAFER GOLD RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點數(shù)量:2011 觸點電鍍:Gold 安裝風格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C
C931U101JUSDAA7317 功能描述:瓷片電容器 250volts 100pF 5% SL RoHS:否 制造商:Kemet 電容:100 pF 容差:5 % 電壓額定值:250 V 工作溫度范圍: 損耗因數(shù) DF: 端接類型:Radial 產(chǎn)品:AC Line Rated Class X1/Y2 Capacitors
C931U101JUSDAAWL20 功能描述:瓷片電容器 250volts 100pF 5% SL RoHS:否 制造商:Kemet 電容:100 pF 容差:5 % 電壓額定值:250 V 工作溫度范圍: 損耗因數(shù) DF: 端接類型:Radial 產(chǎn)品:AC Line Rated Class X1/Y2 Capacitors
發(fā)布緊急采購，3分鐘左右您將得到回復。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*