參數(shù)資料
型號: BYV32EB-200
廠商: NXP Semiconductors N.V.
元件分類: 參考電壓二極管
英文描述: Dual ultrafast power diode
封裝: BYV32EB-200<SOT404 (D2PAK)|<<http://www.nxp.com/packages/SOT404.html<1<week 1, 2005,;
文件頁數(shù): 4/9頁
文件大?。?/td> 134K
代理商: BYV32EB-200
BYV32EB-200_4
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 2 March 2009
4 of 9
NXP Semiconductors
BYV32EB-200
Dual rugged ultrafast rectifier diode, 20 A, 200 V
5.
Thermal characteristics
6.
Characteristics
Table 5.
Symbol
R
th(j-mb)
Thermal characteristics
Parameter
thermal resistance from
junction to mounting
base
Conditions
with heatsink compound; both diodes
conducting
with heatsink compound; per diode; see
Figure 3
minimum footprint FR4 board
Min
-
Typ
-
Max
1.6
Unit
K/W
-
-
2.4
K/W
R
th(j-a)
thermal resistance from
junction to ambient
-
50
-
K/W
Fig 3.
Transient thermal impedance from junction to mounting base as a function of pulse width
003aac980
1
10
1
10
Z
th(j-mb)
(K/W)
10
3
10
2
t
p
(s)
10
6
10
1
10
1
10
5
10
3
10
2
10
4
t
p
t
p
T
T
P
t
δ
=
Table 6.
Symbol
Static characteristics
V
F
Characteristics
Parameter
Conditions
Min
Typ
Max
Unit
forward voltage
I
F
= 8 A; T
j
= 150 °C; see
Figure 4
I
F
= 20 A; T
j
= 25 °C
V
R
= 200 V; T
j
= 25 °C
V
R
= 200 V; T
j
= 100 °C
-
-
-
-
0.72
1
6
0.2
0.85
1.15
30
0.6
V
V
μA
mA
I
R
reverse current
Dynamic characteristics
Q
r
recovered charge
t
rr
reverse recovery time
I
F
= 2 A; V
R
= 30 V; dI
F
/dt = 20 A/μs
I
F
= 1 A; V
R
= 30 V; dI
F
/dt = 100 A/μs;
ramp recovery; T
j
= 25 °C; see
Figure 5
I
F
= 0.5 A; I
R
= 1 A; measured at reverse
current = 0.25 A; step recovery; T
j
= 25 °C;
see
Figure 6
I
F
= 1 A; dI
F
/dt = 10 A/μs; see
Figure 7
-
-
8
20
12.5
25
nC
ns
-
10
20
ns
V
FR
forward recovery
voltage
-
-
1
V
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