參數(shù)資料
型號(hào)： BXM80533B866128
英文描述： Microprocessor
中文描述： 微處理器
文件頁(yè)數(shù)： 4/81頁(yè)
文件大?。?/td> 598K
代理商： BXM80533B866128
Mobile Intel
Celeron Processor (0.18μ) in BGA2 and Micro-PGA2 Packages
Datasheet
Order Number#249563-001
4
Contents
Introduction
...........................................................................................................................................9
1.1
Overview
..........................................................................................................10
1.2
Terminology
.....................................................................................................10
1.3
References
.......................................................................................................11
2.
Mobile Intel Celeron Processor Features
...............................................................................12
2.1
New Features in the Mobile Intel Celeron Processor
.........................................12
2.1.1
On-die GTL+ Termination
....................................................................12
2.1.2
Streaming SIMD Extensions
................................................................12
2.1.3
Signal Differences Between the Mobile Intel Celeron Processors in the
BGA1/Micro-PGA1 and the BGA2/Micro-PGA2
....................................12
2.2
Power Management
.........................................................................................13
2.2.1
Clock Control Architecture
...................................................................13
2.2.2
Normal State
.......................................................................................13
2.2.3
Auto Halt State
....................................................................................13
2.2.4
Stop Grant State
..................................................................................14
2.2.5
Quick Start State
.................................................................................15
2.2.6
HALT/Grant Snoop State
.....................................................................15
2.2.7
Sleep State
..........................................................................................15
2.2.8
Deep Sleep State
.................................................................................16
2.2.9
Operating System Implications of Low-power States
............................16
2.3
GTL+ Signals
...................................................................................................17
2.4
Mobile Intel Celeron Processor CPUID
.............................................................17
3.
Electrical Specifications
.........................................................................................................18
3.1
Processor System Signals
................................................................................18
3.1.1
Power Sequencing Requirements
........................................................19
3.1.2
Test Access Port (TAP) Connection
.....................................................19
3.1.3
Catastrophic Thermal Protection
..........................................................20
3.1.4
Unused Signals
...................................................................................20
3.1.5
Signal State in Low-power States
.........................................................20
3.1.5.1
System Bus Signals
............................................................20
3.1.5.2
CMOS and Open-drain Signals
...........................................20
3.1.5.3
Other Signals
.....................................................................21
3.2
Power Supply Requirements
............................................................................21
3.2.1
Decoupling Recommendations
.............................................................21
3.2.2
Voltage Planes
....................................................................................21
3.3
System Bus Clock and Processor Clocking
......................................................22
3.4
Maximum Ratings
.............................................................................................22
3.5
DC Specifications
.............................................................................................24
3.6
AC Specifications
.............................................................................................27
3.6.1
System Bus, Clock, APIC, TAP, CMOS, and Open-drain AC
Specifications
......................................................................................27
4.
System Signal Simulations
.....................................................................................................40
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