參數(shù)資料
型號(hào): BU506F
廠商: NXP SEMICONDUCTORS
元件分類(lèi): 功率晶體管
英文描述: Silicon Diffused Power Transistor(硅擴(kuò)散功率型晶體管)
中文描述: 5 A, 700 V, NPN, Si, POWER TRANSISTOR, TO-220
封裝: PLASTIC PACKAGE-3
文件頁(yè)數(shù): 2/12頁(yè)
文件大?。?/td> 83K
代理商: BU506F
1997 Aug 14
1
Philips Semiconductors
Product specification
Silicon diffused power transistors
BU506F; BU506DF
DESCRIPTION
High-voltage, high-speed switching
NPN power transistor in a SOT186
package. The BU506DF has an
integrated efficiency diode.
APPLICATIONS
Horizontal deflection circuits of
colour television receivers
Line-operated switch-mode
applications.
PINNING
PIN
(1)
DESCRIPTION
1
2
3
base
collector
emitter
Note
1.
All pins electrically isolated from mounting base.
Fig.1 Simplified outline (SOT186) and symbols.
MBC668
1
2
3
Front view
3
2
1
MBB077
3
2
1
MBB008
a. BU506F.
b. BU506DF.
QUICK REFERENCE DATA
THERMAL CHARACTERISTICS
Notes
1.
2.
Mounted
without
heatsink compound and 30
±
5 N force on centre of package.
Mounted
with
heatsink compound and 30
±
5 N force on centre of package.
SYMBOL
PARAMETER
CONDITIONS
TYP.
MAX.
UNIT
V
CESM
V
CEO
V
CEsat
V
F
I
Csat
I
C
I
CM
P
tot
t
f
collector-emitter peak voltage
collector-emitter voltage
collector-emitter saturation voltage
diode forward voltage (BU506DF)
collector saturation current
collector current (DC)
collector current (peak value)
total power dissipation
fall time
V
BE
= 0
open base
I
C
= 3 A; I
B
= 1.33 A; see Figs 7 and 8
I
F
= 3 A
1.5
0.7
1500
700
1
2.2
3
5
8
20
V
V
V
V
A
A
A
W
μ
s
see Figs 2 and 3
see Figs 2 and 3
T
h
25
°
C; see Fig.4
inductive load; see Fig.11
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th j-h
thermal resistance from junction to external heatsink note 1
6.35
3.85
55
K/W
K/W
K/W
note 2
R
th j-a
thermal resistance from junction to ambient
相關(guān)PDF資料
PDF描述
BU506DF Silicon Diffused Power Transistor(硅擴(kuò)散功率型晶體管)
BU506 Silicon diffused power transistors
BU506D Silicon diffused power transistors
BU5071
BU508AD TRANSISTOR | BJT | NPN | 700V V(BR)CEO | 8A I(C) | TO-218AC
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