- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄2066 > BU4015B (Rohm Semiconductor)IC SHIFT REGISTER DUAL 4B 16DIP PDF資料下載
參數(shù)資料
| 型號： | BU4015B |
| 廠商： | Rohm Semiconductor |
| 文件頁數(shù)： | 7/17頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC SHIFT REGISTER DUAL 4B 16DIP |
| 標(biāo)準(zhǔn)包裝： | 1,000 |
| 系列： | 4000B |
| 邏輯類型： | 移位寄存器 |
| 輸出類型： | 標(biāo)準(zhǔn) |
| 元件數(shù)： | 2 |
| 每個元件的位元數(shù)： | 4 |
| 功能： | 串行至并行 |
| 電源電壓： | 3 V ~ 16 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 通孔 |
| 封裝/外殼： | 16-DIP（0.300"，7.62mm） |
| 供應(yīng)商設(shè)備封裝： | 16-DIP |
| 包裝： | 管件 |
Technical Note
BU7251G,BU7251SG, BU7231G,BU7231SG,
BU7252F/FVM,BU7252S F/FVM,BU7232F/FVM,BU7232S F/FVM
15/18
●Derating curve
Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature).IC is heated
when it consumed power, and the temperature of IC ship becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited. Power
dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal resistance of
package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in the
storage package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in
the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame of the
package. The parameter which indicates this heat dissipation capability (hardness of heat release) is called thermal
resistance, represented by the symbol
θj-a[℃/W]. The temperature of IC inside the package can be estimated by this thermal
resistance. Fig.93 (a) shows the model of thermal resistance of the package. Thermal resistance
θja, ambient temperature Ta,
junction temperature Tj, and power dissipation Pd can be calculated by the equation below :
θja ＝ (Tj-Ta) / Pd
[℃/W]
····· (Ⅰ)
Derating curve in Fig.93 (b) indicates power that can be consumed by IC with reference to ambient temperature. Power that
can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal
resistance
θja. Thermal resistance θja depends on chip size, power consumption, package, ambient temperature, package
condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value
measured at a specified condition. Fig94(c)-(f) show a derating curve for an example of BU7251family, BU7252 family, BU7231
family, BU7232 family.
(*8)
(*9)
(*10)
Unit
5.4
6.2
4.8
[mW/℃]
When using the unit above Ta=25[℃], subtract the value above per degree[℃]. Permissible dissipation is the value
when FR4 glass epoxy board 70[mm]×70[mm]×1.6[mm] (cooper foil area below 3[%]) is mounted.
Fig. 94.
050
75
100
125
150
25
P1
P2
Pd(max)
LSI
の消費(fèi)電力[W]
θja2
θja1
Tj(max)
θja2 < θja1
周囲溫度Ta[℃]
BU7251/BU7231
Tj(max)
Power dissipation Pd:[W]
Ambient temperature:Ta[
℃]
(a) Thermal resistance
(b) Derating curve
Fig. 93. Thermal resistance and power dissipation
Derating curve
0
200
400
600
800
050
100
150
AMBIENT TEMPERATURE [
℃]
PO
W
ER
D
ISSI
PAT
IO
N
[
m
W
]
.
85
0
200
400
600
800
1000
0
50
100
150
AMBIENT TEMPERATURE [
℃]
PO
W
ER
D
ISSI
PA
T
IO
N
[m
W
]
.
85
0
200
400
600
800
0
50
100
150
AMBIENT TEMPERATURE [
℃]
PO
W
ER
D
ISSI
PAT
IO
N
[
m
W
]
.
BU7231SG(*8)
105
0
200
400
600
800
1000
0
50
100
150
AMBIENT TEMPERATURE [
℃]
PO
W
ER
D
ISSI
PA
T
IO
N
[m
W
]
.
105
(c) BU7251G
BU7231G
(d) BU7252F/FVM
BU7232F/FVM
(e) BU7251SG
BU7231SG
(f) BU7252S F/FVM
BU72432S F/FVM
BU7251SG(*8)
BU7251G(*8)
BU7231G(*8)
540[mw]
620[mw]
480[mw]
540[mw]
BU7252F(*9)
BU7232F(*9)
BU7252FVM(*10)
BU7232FVM(*10)
620[mw]
480[mw]
BU7252SF(*9)
BU7232SF(*9)
BU7252SFVM(*10)
BU7232SFVM(*10)
Ambient temperature Ta [
℃]
Chip surface temperature Tj [
℃]
Power dissipation P [W]
θja = ( Tj ーTa ) / Pd [℃/W]
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| BU4S584G2-TL | IC SCHMITT TRIGGER SINGLE SSOP5 |
| BU7232SFVM-TR | IC COMPARATOR DUAL 5.5V MSOP-8 |
| BU7331EKN-E2 | IC CLOCK GEN 3CH PLL 20HQFN |
| BUF20820AIDCPRE4 | IC 18CH PROG V-REF GEN 38-HTSSOP |
| CD4072BPWRG4 | IC DUAL 4INPUT OR GATE 14-TSSOP |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BU4015B/BF | 制造商:ROHM 制造商全稱:Rohm 功能描述:Standard LSIs |
| BU4015B_09 | 制造商:ROHM 制造商全稱:Rohm 功能描述:High Voltage CMOS Logic ICs |
| BU4015B-E2 | 制造商:ROHM 制造商全稱:Rohm 功能描述:High Voltage CMOS Logic ICs |
| BU4015BF | 制造商:ROHM 制造商全稱:Rohm 功能描述:Dual 4-bit static shift register |
| BU4015BF-E2 | 功能描述:計數(shù)器移位寄存器 DUAL 4 BIT STATIC SHIFT REGULATOR RoHS:否 制造商:Texas Instruments 計數(shù)器類型: 計數(shù)順序:Serial to Serial/Parallel 電路數(shù)量:1 封裝 / 箱體:SOIC-20 Wide 邏輯系列: 邏輯類型: 輸入線路數(shù)量:1 輸出類型:Open Drain 傳播延遲時間:650 ns 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 封裝:Reel |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。