Technical Note
BH
□□
PB1WHFV Series
7/9
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2009.04 - Rev.A
0.01
0.1
1
10
100
0
50
100
150
Output Current
Io
(
mA)
E
)
Stable region
Input Output capacitors
It is recommended to insert bypass capacitors between input and GND pins, positioning them as close to the pins as
possible. These capacitors will be used when the power supply impedance increases or when long wiring paths are used, so
they should be checked once the IC has been mounted.
Ceramic capacitors generally have temperature and DC bias characteristics. When selecting ceramic capacitors, use X5R or
X7R, or better models that offer good temperature and DC bias characteristics and high tolerant voltages.
Typical ceramic capacitor characteristics
Output capacitors
Mounting input capacitor between input pin and GND(as close to pin as possible), and also output capacitor between output
pin and GND(as close to pin as possible) is recommended.
The input capacitor reduces the output impedance of the voltage supply source connected to the VCC. The higher value the
output capacitor goes, the more stable the whole operation becomes. This leads to high load transient response. Please
confirm the whole operation on actual application board.
Generally, ceramic capacitor has wide range of tolerance, temperature coefficient, and DC bias characteristic. And also its value goes
lower as time progresses. Please choose ceramic capacitors after obtaining more detailed data by asking capacitor makers.
Operation Notes
1. Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break
down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated
values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses.
2. Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
3. Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
4.Thermal shutdown circuit (TSD)
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit is designed only to shut the
IC off to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do not continue to
use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed.
5. Ground wiring patterns
The power supply and ground lines must be as short and thick as possible to reduce line impedance. Fluctuating voltage
on the power ground line may damage the device.
0
20
40
60
80
100
120
0
1
2
3
4
DC bias Vdc (V)
C
70
75
80
85
90
95
100
0
1
2
3
4
DC bias Vdc (V)
C
0
20
40
60
80
100
120
-25
0
25
50
75
Temp[
℃
]
C
10V
rated voltage
50 V
rated voltage
16 V
rated voltage
10 V
rated voltage
Fig. 28 Capacitance vs Bias (Y5V)
Fig. 29 Capacitance vs
Bias (X5R, X7R)
Fig. 30 Capacitance vs
Temperature (X5R, X7R, Y5V)
Fig. 31 Stable Operation Region (Example)
C
OUT
= 0.47
F
Ta = +25°C
BH
□□
PB1WHFV
16 V
rated voltage
50 V
rated voltage
X7R
X5R
Y5V