參數(shù)資料
型號(hào): BGY204
廠商: NXP SEMICONDUCTORS
元件分類: 衰減器
英文描述: UHF amplifier module
中文描述: 880 MHz - 915 MHz RF/MICROWAVE NARROW BAND HIGH POWER AMPLIFIER
封裝: SOT-321B, 4 PIN
文件頁數(shù): 9/11頁
文件大?。?/td> 61K
代理商: BGY204
1996 May 21
9
Philips Semiconductors
Product specification
UHF amplifier module
BGY204
SOLDERING
The indicated temperatures are those at the solder
interfaces.
Advised solder types are types with a liquidus less than or
equal to 210
°
C.
Solder dots or solder prints must be large enough to wet
the contact areas.
Footprints for soldering should cover the module contact
area +0.1 mm on all sides.
Soldering can be carried out using a conveyor oven, a hot
air oven, an infrared oven or a combination of these ovens.
Hand soldering must be avoided because the soldering
iron tip can exceed the maximum permitted temperature of
250
°
C and damage the module.
The maximum temperature profile and soldering time is
indicated as follows (see Fig.16):
t = 350 s at 100
°
C
t = 300 s at 125
°
C
t = 200 s at 150
°
C
t = 100 s at 175
°
C
t = 50 s at 200
°
C
t = 5 s at 250
°
C (maximum temperature).
Cleaning
The following fluids may be used for cleaning:
Alcohol
Bio-Act (Terpene Hydrocarbon)
Triclean B/S
Acetone.
Ultrasonic cleaning should not be used since this can
cause serious damage to the product.
Fig.16 Maximum allowable temperature profile.
handbook, halfpage
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BGY209 制造商:未知廠家 制造商全稱:未知廠家 功能描述:RF Amplifier