- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄375401 > BGY122B (NXP SEMICONDUCTORS) UHF amplifier modules PDF資料下載
參數(shù)資料
| 型號： | BGY122B |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 衰減器 |
| 英文描述： | UHF amplifier modules |
| 中文描述： | 872 MHz - 905 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| 封裝： | SOT-388B, 4 PIN |
| 文件頁數(shù)： | 10/16頁 |
| 文件大?。?/td> | 97K |
| 代理商： | BGY122B |
1998 May 11
10
Philips Semiconductors
Product specification
UHF amplifier modules
BGY122A; BGY122B
SOLDERING
The indicated temperatures are those at the solder
interfaces.
Advised solder types are types with a liquidus less than or
equal to 210
°
C.
Solder dots or solder prints must be large enough to wet
the contact areas.
Soldering can be carried out using a conveyor oven, a hot
air oven, an infrared oven or a combination of these ovens.
A double reflow process is permitted.
Hand soldering must be avoided because the soldering
iron tip can exceed the maximum permitted temperature of
250
°
C and damage the module.
The maximum allowed temperature is 250
°
C for a
maximum of 5 seconds.
The maximum ramp-up is 10
°
C per second.
The maximum cool-down is 5
°
C per second.
Cleaning
The following fluids may be used for cleaning:
Alcohol
Bio-Act (Terpene Hydrocarbon)
Acetone.
Ultrasonic cleaning should not be used since this can
cause serious damage to the product.
Fig.19 Recommended reflow temperature profile.
handbook, halfpage
0
200
100
0
1
5
2
3
4
MGM159
t (min)
T
(
°
C)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| BGY2016 | UHF amplifier module |
| BGY204 | UHF amplifier module |
| BGY205 | UHF amplifier module |
| BGY206 | UHF amplifier module |
| BGY32 | VHF power amplifier modules |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BGY132 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:RF Amplifier |
| BGY133 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:RF Amplifier |
| BGY135 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:RF Amplifier |
| BGY136 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:VHF power amplifier modules |
| BGY143 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:RF Amplifier |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。