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參數(shù)資料
| 型號： | BD6669FV |
| 廠商： | Rohm CO.,LTD. |
| 英文描述： | SPDT SUBMINIATURE POWER RELAY |
| 中文描述： | 3相為主軸電機(jī)驅(qū)動器的CD - ROM的 |
| 文件頁數(shù)： | 16/17頁 |
| 文件大?。?/td> | 213K |
| 代理商： | BD6669FV |
BD6669FV
Motor driver ICs
3. Thermal design
The thermal design should allow enough margin for actual power dissipation.
4. Mounting failures
Mounting failures, such as misdirection or mismounts, may destroy the device.
5. Electromagnetic fields
A strong electromagnetic field may cause malfunctions.
6. Coil current flowing into V
M
A coil current-flows from motor into V
M
when torque control input changes from EC<ECR into EC>ECR, and V
M
voltage rises if V
M
voltage source doesn’t have an ability of current drain.
Make sure that surrounding circuits work correctly and aren’t destroyed, when V
M
voltage rises.
Physical countermeasures, such as a diode for voltage clamp, need to be considered under these conditions.
7. CNF pin
An appropriate capacitor (100pF (typ.)) at CNF pin make motor current smooth. Make sure the motor current doesn’t
oscillate, even in transition.
z
Electrical characteristics curve
Pd (W)
Rev.A
16/16
Fig.16 Power dissipation curve
70mm
×
70mm
×
1.6mm glass epoxy board.
Reduce power by 8.16mW for each degree above 25
°
C.
0
50
25
75
100
125
150
Ta (
°
C)
0.50
1.02
0
z
External dimensions
(Units : mm)
SSOP-B28
0.15
±
0.1
0
1
±
0
1
0.65
7
±
0
5
±
0
28
10.0
±
0.2
0
14
15
0.22
±
0.1
0.1
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