參數(shù)資料
型號(hào): B048L120T15
廠商: Vicor Corporation
元件分類: DC/DC變換器
英文描述: VI Chip - BCM Bus Converter Module
中文描述: 六芯片- BCM的總線轉(zhuǎn)換器模塊
文件頁(yè)數(shù): 8/16頁(yè)
文件大小: 725K
代理商: B048L120T15
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
VI Chip Bus Converter
B048K120T10
Rev. 1.2
Page 8 of 16
4
5
NOTES:
1- DIMENSIONS ARE .
2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
3- PRODUCT MARKING ON BOTH TOP AND BOTTOM SURFACES
inch
mm
30,00
1.181
1,00
15,00
0.591
18,00
0.709
1,00
9,00
0.354
1,00
0.039
1,00
0.039
I
O
L
L
C
C
BOTTOM VIEW
SOLDER BALL #A1
(106) X 0,51
SEATING PLANE
TOP VIEW (COMPONENT SIDE)
O
I
SOLDER BALL
SOLDER BALL
TYP
4,0
0.16
15,7
0.62
21,5
0.85
32,0
1.26
1,6
0.06
28,8
1.13
6,0
0.24
16,0
Mechanical Drawings
PRELIMINARY
Figure 16
—BCM BGA mechanical outline; In-board mounting
NOTES:
1- DIMENSIONS ARE inch
2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
mm
15,00
0.591
17,00
0.669
20,00
13,00
0.512
16,00
0.630
24,00
0.945
8,00
0.315
16,16
0.636
8,08
0.318
18,00
0.709
1,00
9,00
0,37
0.015
29,26
1.152
(2) X 10,00
(4) X 6,00
1,00
0.039
PCB CUTOUT
+
+
-
+
-
-
S
T
P
SOLDER PAD #A1
RECOMMENDED LAND AND VIA PATTERN
(COMPONENT SIDE SHOWN)
SOLDER MASK
1,6
0,51
0.020
1,50
0,50
1,00
0.039
0,50
0.020
SOLDER MASK
CONNECT TO
(106) X
(4) X R
( 0.020
(0.039
0,53
(0.039
Figure 17
—BCM BGA PCB land/VIA layout information; In-board mounting
IN-BOARD MOUNTING
BGA surface mounting requires a
cutout in the PCB in which to recess the VI Chip
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