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參數(shù)資料
| 型號： | B048L120T15 |
| 廠商： | Vicor Corporation |
| 元件分類： | DC/DC變換器 |
| 英文描述： | VI Chip - BCM Bus Converter Module |
| 中文描述： | 六芯片- BCM的總線轉(zhuǎn)換器模塊 |
| 文件頁數(shù)： | 14/16頁 |
| 文件大小： | 725K |
| 代理商： | B048L120T15 |
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
VI Chip Bus Converter
B048K120T10
Rev. 1.2
Page 14 of 16
4
5
Application Note (continued)
PRELIMINARY
Figure 30
—Thermal profile diagram
VI Chip Handling and Solderability
The product should remain in its package in a dry environment
until ready for use.
The following table shows the soldering requirements for both
the BGAin-board surface mount package and the J-lead
on-board surface mount package.
The reflow process should use industry standard Surface Mount
Technology (SMT) conditions. The exact conditions will
depend upon the solder paste manufacturer’s recommendations.
Under no circumstance should the case temperature exceed
208°C. Refer to Fig. 30 for a suggested thermal profile.
BGAPackage
63/37 "No Clean"*
4-6 mil
20 mil; 1:1 ratio
Within 50% of pad center
<500 in/sec
2
J-Lead Package
63/37 "No Clean"
4-6 mil
0.8-0.9:1 ratio
± 5 mil
<500 in/sec
2
Solder Paste
Stencil Thickness
Stencil Aperture
Placement
Acceleration Rate
*Halide free water washable 63/37 Flux paste can be used for the BGAversion
package only. Please consult our Application Engineers for further information.
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相關(guān)代理商/技術(shù)參數(shù) |
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| B048T015M14 | 制造商:VICOR 制造商全稱:Vicor Corporation 功能描述:BCM Bus Converter |
| B048T015T14 | 制造商:VICOR 制造商全稱:Vicor Corporation 功能描述:BCM Bus Converter |
| B048T030M21 | 制造商:VICOR 制造商全稱:Vicor Corporation 功能描述:BCM Bus Converter |
| B048T030T21 | 制造商:VICOR 制造商全稱:Vicor Corporation 功能描述:BCM Bus Converter |
| B048T040M20 | 制造商:VICOR 制造商全稱:Vicor Corporation 功能描述:BCM Bus Converter |
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