參數(shù)資料
型號: AT32UC3L032-ZAUT
廠商: Atmel
文件頁數(shù): 55/174頁
文件大?。?/td> 0K
描述: IC MCU 32K FLASH 16K 48-VQFN
產(chǎn)品培訓(xùn)模塊: MCU Product Line Introduction
AVR® UC3 Introduction
標(biāo)準(zhǔn)包裝: 2,080
系列: AVR®32 UC3 L
核心處理器: AVR
芯體尺寸: 32-位
速度: 50MHz
連通性: I²C,SPI,UART/USART
外圍設(shè)備: 欠壓檢測/復(fù)位,DMA,POR,PWM,WDT
輸入/輸出數(shù): 36
程序存儲器容量: 32KB(32K x 8)
程序存儲器類型: 閃存
RAM 容量: 16K x 8
電壓 - 電源 (Vcc/Vdd): 1.62 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 9x12b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 48-VFQFN 裸露焊盤
包裝: 托盤
其它名稱: 32UC3L032-ZAUT
32UC3L032-ZAUT-ND
2006 Microchip Technology Inc.
DS70117F-page 213
dsPIC30F6011/6012/6013/6014
80-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
E1
#leads = n1
p
B
L
φ
β
c
2
n
1
(F)
A
A1
α
A2
E
D1
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
.630 BSC
NOM
INCHES
.630 BSC
.551 BSC
Overall Width
Overall Length
Foot Angle
Foot Length
Pins per Side
Overall Height
Number of Pins
Lead Width
Revised 7-20-06
Lead Thickness
Molded Package Thickness
* Controlling Parameter
JEDEC Equivalent: MS-026
Mold Draft Angle Bottom
Mold Draft Angle Top
Molded Package Width
Molded Package Length
Footprint
Notes:
Pitch
Standoff
β
Dimension Limits
α
B
D1
E1
c
φ
D
E
F
L
11°
.011
.004
.018
MIN
A
A1
A2
n1
p
Units
n
.037
.002
12°
.013
3.5°
.039 REF.
.024
.015
.008
13°
.030
20
.026
.039
80
.041
.006
.047
MAX
16.00 BSC
14.00 BSC
0.27
0.09
0.45
0.32
1.00 REF.
0.60
3.5°
MILLIMETERS*
0.95
0.05
MIN
0.65
1.00
20
NOM
80
0.37
0.20
0.75
1.05
0.15
1.20
MAX
13°
12°
11°
12°
11°
13°
12°
13°
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
Drawing No. C04-116
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