參數(shù)資料
型號(hào)： AS8501-ASOT
廠商： ams
文件頁數(shù)： 23/41頁
文件大?。?/td> 0K
描述： IC CURRENT MEASURE SOLAR 16-SOIC
標(biāo)準(zhǔn)包裝： 1,500
類型： 數(shù)據(jù)采集系統(tǒng)（DAS）
輸入類型： 模擬，數(shù)字
輸出類型： 模擬，數(shù)字
接口： 串行
電流 - 電源： 5mA
安裝類型： 表面貼裝
封裝/外殼： 16-SOIC（0.295"，7.50mm 寬）
供應(yīng)商設(shè)備封裝： 16-SOIC
包裝： 帶卷 (TR)
AS8501 - Data Sheet
austriamicrosystems
Revision 1.1, 04-April-06
www.austriamicrosystems.com
Page 2 of 40
CONTENTS
1
FEATURES ........................................................................................................................................................................................ 1
2
APPLICATIONS................................................................................................................................................................................. 1
3
GENERAL DESCRIPTION ................................................................................................................................................................ 1
4
PIN FUNCTION DESCRIPTION FOR SOIC 16 PACKAGE.............................................................................................................. 3
5
ABSOLUTE MAXIMUM RATINGS.................................................................................................................................................... 4
6
ELECTRICAL CHARACTERISTICS ................................................................................................................................................. 5
7
FUNCTIONAL DESCRIPTION .......................................................................................................................................................... 9
7.1
POWER ON RESET........................................................................................................................................................................... 9
7.2
ANALOG PART, GENERAL DESCRIPTION ............................................................................................................................................ 9
7.2.1
Reference voltage ............................................................................................................................................................ 10
7.2.2
Current sources ................................................................................................................................................................ 11
7.2.3
Internal temperature sensor ............................................................................................................................................. 12
7.3
DIGITAL PART................................................................................................................................................................................ 12
7.3.1
Sampling rate ................................................................................................................................................................... 12
7.3.2
Calibration ........................................................................................................................................................................ 13
7.4
MODES OF OPERATION .................................................................................................................................................................. 13
7.5
REGISTER DESCRIPTION ................................................................................................................................................................ 15
7.5.1
OPM operation mode register ( 4 bits ) ............................................................................................................................ 16
7.5.2
CRG general configuration register ( 28 bits ) .................................................................................................................. 16
7.5.3
CRA measurement channel A configuration register ( 17 bits ) ..................................................................................... 17
7.5.4
CRB measurement channel B configuration register ( 17 bits ) ...................................................................................... 19
7.5.5
ZZR Zener-Zap register (188 bits ).................................................................................................................................. 20
7.5.6
CAR calibration register ( 110 bits )................................................................................................................................. 22
7.5.7
TRR trimming register ( 20 bits ) ...................................................................................................................................... 22
7.5.8
THR alarm (Wake-up) threshold register ( 17 bits )......................................................................................................... 25
7.5.9
MSR measurement result register ( 18 bits )................................................................................................................... 25
8
DIGITAL INTERFACE DESCRIPTION............................................................................................................................................ 25
8.1
CLK ............................................................................................................................................................................................. 25
8.2
INTN............................................................................................................................................................................................ 25
8.3
SDI BUS OPERATION...................................................................................................................................................................... 26
8.4
DATA TRANSFERS.......................................................................................................................................................................... 27
8.5
SDI BUS TIMING............................................................................................................................................................................. 28
8.6
SDI ACCESS TO OTP MEMORY....................................................................................................................................................... 29
8.6.1
ZZR register bit mapping .................................................................................................................................................. 29
8.6.2
Stored ZZR-register mapping ........................................................................................................................................... 33
9
GENERAL APPLICATION HINTS................................................................................................................................................... 34
9.1
GROUND CONNECTION, ANALOG COMMON....................................................................................................................................... 34
9.2
THERMAL EMF.............................................................................................................................................................................. 34
9.3
NOISE CONSIDERATIONS................................................................................................................................................................ 35
9.4
SHIELDING, GUARDING................................................................................................................................................................... 35
10
TYPICAL PERFORMANCE CHARACTERISTICS.......................................................................................................................... 36
11
PACKAGE DIMENSIONS................................................................................................................................................................ 38
12
REVISION HISTORY ....................................................................................................................................................................... 38
13
ORDERING INFORMATION............................................................................................................................................................ 38
14
CONTACT........................................................................................................................................................................................ 39
14.1
HEADQUARTERS ...................................................................................................................................................................... 39
14.2
SALES OFFICES ....................................................................................................................................................................... 39
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