
AS3515 V15
austriamicrosystems
Data Sheet, Confidential
www.austriamicrosystems.com
Revision 3.1
6
- 66
5 Absolute Maximum Ratings (Non-Operating)
Stresses beyond the absolute maximum ratings may cause permanent damage to the device. These are stress ratings only. Functional
operation of the device at these or beyond those listed is not implied.
Caution: Exposure to absolute maximum rating conditions may affect device reliability.
Table 1
Absolute Maximum Ratings
PARAMETER
Symbol
MIN
MAX
UNIT
NOTE
DC Supply Voltage
BVDD, UVDD,
RTCSUP, CHGIN
-0.5
7.0
V
Voltage difference of VSS-
Terminals
DVSS, AVSS, VSS3,
VSS15, VSSCP, BVSS
-0.5
0.5
V
Voltage at Digital pins
Vin
-0.5
5.0
V
VB1V, CSCL, CSDA, PWR_UP
these pins have no diode to
DVDD
Voltage at Digital pins:
Vin
-0.5
DVDD+0.5
V
LRCK, SCLK, SDI, SDO,
P_PVDD, P_CVDD, BATTEMP,
ISINK, XIN32K, XOUT32K,
XIRQ, PWGOOD
Voltage at 5V pins:
Vin
-0.5
BVDD+0.5V
V
BGND, HPH_CM, HPGND,
HPL/R, SPL/R
Voltage at Analogue pins:
Vin
-0.5
AVDD+0.5
V
LOUTL/R, VREF, AGND,
LIN1L/R, LIN2L/R, MIC1P/N,
MIC2P/N, MIC1SUP, MIC2SUP
Voltage at Regulator pins:
Vin
-0.5
5.0
V
AVDD, DVDD, PVDD, CPVDD,
CVDD
Input Current (latchup
immunity)
Iscr
-100
100
mA
Norm: Jedec 17
Electrostatic Discharge HBM ESD
+/-1
kV
Norm: MIL 883 E method 3015
Total Power Dissipation (all
supplies and outputs)
Pt
-
1000
mW
Valid for BGA64 package
Storage Temperature
Tstrg
-55
125
°C
Humidity non-condensing
5
85
%
Table 2
Soldering Conditions
Symbol
Parameter
Min
Max
Unit
Comments
Tbody
Package Body Temperature
260
°C
Norm IPC/JEDEC J-STD-020C, reflects
moisture sensitivity level only
Tpeak
235
245
°C
Dwell
Solder Profile*
30
45
s
above 217 °C
MSL
Moisture Sensitive Level
3
1
Represents a max. floor live time of
168h
* austriamicrosystems AG strongly recommends to use underfill.
ams
AG
Technical
content
still
valid