參數資料
| 型號： | AS2536 |
| 廠商： | ams |
| 文件頁數： | 17/26頁 |
| 文件大小： | 0K |
| 描述： | IC TELEPHONE CMOS MULTIFU 28SOIC |
| 標準包裝： | 27 |
| 系列： | * |
Data She et AS25 33-36
austriamicrosystems
Revision 8.10
Page 23 of 25
Conditions for Delivery as Dice on Foil, sawn
Die thickness
380
± 20 m
Back finishing
back grinding, silicon
Frame
Material: Plastic
Size: see figure
Frame Position Tolerance
Center wafer to frame:
± 4mm
Angle deviation wafer to frame:
± 8°
Orientation wafer to frame: Wafer flat to frame side with kerfs
Covering adhesive foil to frame: >5mm
Tape
Type: PVC with acrylic adhesive
Thickness: 70
± 20 m
Sawing conditions
Sawing mode: Saw - through mode
Sawing width: typ. 60
m
Kerf depth in foil: typ. 20
m
XV -dimension deviation: max.25
m
Packing
frame sealed in foil bags filled with nitrogen
Storage time In sealed bags
2 months, Tamb = 25
°C
Mechanical Drawing of Frame (valid for 200 mm and 150 mm wafer)
ams
AG
Technical
content
still
valid
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相關代理商/技術參數 |
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| AS25360FLF | 制造商:TT Electronics / IRC 功能描述:AS25360FLF |
| AS25360HLF | 制造商:TT Electronics / IRC 功能描述:AS25360HLF |
| AS25360JLF | 制造商:TT Electronics / IRC 功能描述:AS25360JLF |
| AS25361FLF | 制造商:TT Electronics / IRC 功能描述:AS25361FLF |
| AS25361HLF | 制造商:TT Electronics / IRC 功能描述:AS25361HLF |
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