參數(shù)資料
型號(hào): APL5325BI-TRG
廠商: ANPEC ELECTRONICS CORP
元件分類: 可調(diào)正電壓?jiǎn)温份敵鯨DO穩(wěn)壓器
英文描述: ADJUSTABLE POSITIVE LDO REGULATOR, PDSO5
封裝: GREEN, TO-178AA, SOT-23, 5 PIN
文件頁(yè)數(shù): 15/15頁(yè)
文件大小: 259K
代理商: APL5325BI-TRG
Copyright
ANPEC Electronics Corp.
Rev. A.1 - Nov., 2008
APL5325
www.anpec.com.tw
15
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp-up rate
(T
L
to T
P
)
Preheat
-
Temperature Min (Tsmin)
-
Temperature Max (Tsmax)
-
Time (min to max) (ts)
Time maintained above:
-
Temperature (T
L
)
-
Time (t
L
)
Peak/Classification Temperature (Tp)
Time within 5
°
C of actual
Peak Temperature (tp)
Ramp-down Rate
Time 25
°
C to Peak Temperature
Note: All temperatures refer to topside of the package. Measured on the body surface.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
3
°
C/second max.
3
°
C/second max.
100
°
C
150
°
C
60-120 seconds
150
°
C
200
°
C
60-180 seconds
183
°
C
60-150 seconds
217
°
C
60-150 seconds
See table 1
See table 2
10-30 seconds
20-40 seconds
6
°
C/second max.
6 minutes max.
6
°
C/second max.
8 minutes max.
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Volume mm
3
Package Thickness
<350
260 +0
°
C*
260 +0
°
C*
250 +0
°
C*
Volume mm
3
350-2000
260 +0
°
C*
250 +0
°
C*
245 +0
°
C*
Volume mm
3
>2000
260 +0
°
C*
245 +0
°
C*
245 +0
°
C*
<1.6 mm
1.6 mm – 2.5 mm
2.5 mm
* Tolerance: The device manufacturer/supplier
shall
assure process compatibility up to and including the stated
classification temperature (this means Peak reflow temperature +0
°
C. For example 260
°
C+0
°
C) at the rated MSL
level.
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
Package Thickness
Volume mm
3
<350
240 +0/-5
°
C
225 +0/-5
°
C
Volume mm
3
3
350
225 +0/-5
°
C
225 +0/-5
°
C
<2.5 mm
2.5 mm
Classification Reflow Profiles
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